Damyon L. CORBIN

City:

Jericho, Vermont

Country:

United States

Published Applications:

Last publication date:

2020-01-23

Top Assignees for applications by Damyon L. CORBIN

The entities that hold a legal rights for patent applications filed by inventor CORBIN Damyon L.:

Damyon L. CORBIN from Jericho, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Package assembly for thin wafer shipping and method of use

Package assembly for thin wafer shipping and method of use

Package assembly for thin wafer shipping and method of use

Package assembly for thin wafer shipping and method of use

PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING

Backside metal ground plane with improved metal adhesion and design structures

InventorID:

829660 ⎘