Osaka
Japan
8
2015-10-01
The entities that hold a legal rights for patent applications filed by inventor Wakuda Daisuke:
Daisuke Wakuda from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Elastic flexible substrate and manufacturing method therefor
#2 | 2015-10-01Elastic flexible substrate and method for manufacturing the same
#3 | 2015-10-01Elastic flexible substrate and manufacturing method thereof
#4 | 2014-11-20Method for presenting tactile sensation and device therefor
#5 | 2014-09-18Method for presenting tactile sensation and device therefor
#6 | 2014-08-28Tactile sense presentation device and tactile sense presentation method
#7 | 2014-08-14Touch panel device with tactile sense presenting function
#8 | 2014-07-10METHOD FOR PRESENTING TACTILE SENSATION AND DEVICE THEREFOR
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