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Inventor profile of:

Tadasuke Endo

City:

Tokyo

Country:

Japan

Published Applications:

6

Last publication date:

2023-01-19

Top Assignees for applications by Tadasuke Endo

The entities that hold a legal rights for patent applications filed by inventor Endo Tadasuke:

SUMITOMO BAKELITE CO., LTD. 3 Tokyo, Japan

Recent patent applications by Endo Tadasuke

Tadasuke Endo from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-01-19

US20230018491A1

Chemistry; metallurgy

THERMOSETTING RESIN COMPOSITION, RESIN SHEET, AND METAL BASE SUBSTRATE

#2 | 2022-11-24

US20220372208A1

Chemistry; metallurgy

THERMOSETTING RESIN COMPOSITION, RESIN SHEET, AND METAL BASE SUBSTRATE

#3 | 2013-05-02

US20130105200A1

Performing operations; transporting

PREPREG, WIRING BOARD, AND SEMICONDUCTOR DEVICE

#4 | 2013-02-14

US20130037310A1

Chemistry; metallurgy

EPOXY RESIN COMPOSITION FOR CIRCUIT BOARD, PREPREG, LAMINATE, RESIN SHEET, LAMINATED BASE MATERIAL FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE

#5 | 2011-08-25

US20110205721A1

RESIN COMPOSITION, RESIN SHEET, PREPREG, LAMINATE, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE

#6 | 2010-09-09

US20100227170A1

Epoxy resin composition, prepreg, laminate board, multilayer printed wiring board, semiconductor device, insulating resin sheet, and process for manufacturing multilayer printed wiring board

InventorID:

84079 ⎘