Toshimasa SUGIMURA

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2014-07-24

Top Assignees for applications by Toshimasa SUGIMURA

The entities that hold a legal rights for patent applications filed by inventor SUGIMURA Toshimasa:

Toshimasa SUGIMURA from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Dicing tape-integrated film for semiconductor back surface

Dicing tape-integrated film for semiconductor back surface

METHOD FOR PROCESSING WAFER

METHOD FOR SEPARATING AND REMOVING DICING SURFACE PROTECTION TAPE FROM OBJECT TO BE CUT

Polarizing plate, optical film and image display

InventorID:

843775 ⎘