Ronilo V. Boja

City:

Gilroy, California

Country:

United States

Published Applications:

Last publication date:

2015-07-23

Top Assignees for applications by Ronilo V. Boja

The entities that hold a legal rights for patent applications filed by inventor Boja Ronilo V.:

Ronilo V. Boja from Gilroy, US has applied for patents for these inventions. The list has both pending applications and granted patents:

System, method, and computer program product for a cavity package-on-package structure

Process for manufacturing a printed circuit board having high density microvias formed in a thick substrate

InventorID:

849516 ⎘