🔗 Permalink

Inventor profile of:

Kay S. Essig

City:

Leipzig

Country:

Germany

Published Applications:

1

Last publication date:

2013-02-14

Recent patent applications by Essig Kay S.

Kay S. Essig from Leipzig, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-02-14

US20130037929A1

STACKABLE WAFER LEVEL PACKAGES AND RELATED METHODS

InventorID:

85309 ⎘