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Inventor profile of:

Kozo HARADA

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2024-02-15

Top Assignees for applications by Kozo HARADA

The entities that hold a legal rights for patent applications filed by inventor HARADA Kozo:

MITSUBISHI ELECTRIC CORPORATION 7 TOKYO, Japan
RENESAS ELECTRONICS CORPORATION 7 Kanagawa, Japan
Renesas Technology Corp. 7 Tokyo, Japan
RENESAS ELECTRONICS CORPORATION 6 Tokyo, Japan
RENESAS ELECTRONICS CORPORATION 3 Kawasaki-shi, Japan
Renesas Technology Corp. 2 Chiyoda-ku, Japan
JFE Steel Corporation 1 , Japan
JFE STEEL CORPORATION, A CORPORATION OF JAPAN 1 Chiyoda-ku, Tokyo, Japan

Recent patent applications by HARADA Kozo

Kozo HARADA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-02-15

US20240055357A1

Electricity

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND POWER CONVERSION DEVICE

#2 | 2023-08-31

US20230271579A1

Performing operations; transporting

Power conversion apparatus, electric power system for aircraft, and method of controlling power conversion apparatus

#3 | 2023-04-06

US20230105637A1

Electricity

POWER MODULE, POWER SEMICONDUCTOR DEVICE, AND MANUFACTURING METHODS THEREFOR

#4 | 2023-01-26

US20230024580A1

Electricity

Semiconductor module and power conversion apparatus

#5 | 2022-12-29

US20220415735A1

Electricity

POWER MODULE AND POWER CONVERSION DEVICE

#6 | 2022-05-26

US20220165700A1

Electricity

Power semiconductor module and power converter

#7 | 2019-07-18

US20190221509A1

Electricity

Semiconductor device and method of manufacturing the same

#8 | 2018-03-08

US20180068936A1

Electricity

Semiconductor device and method of manufacturing the same

#9 | 2017-04-27

US20170117216A1

Electricity

Semiconductor device

#10 | 2016-12-08

US20160358846A1

Electricity

Semiconductor device and method of manufacturing the same

#11 | 2016-07-07

US20160196987A1

Electricity

Semiconductor device and method of manufacturing the same

#12 | 2015-12-10

US20150357262A1

Electricity

Semiconductor device and heat-conductive sheet

#13 | 2015-04-09

US20150099331A1

Electricity

Semiconductor device and method of manufacturing

#14 | 2014-11-06

US20140327137A1

Electricity

Semiconductor device and method of manufacturing the same

#15 | 2014-02-06

US20140038361A1

Electricity

Semiconductor device and method of manufacturing the same

#16 | 2013-09-05

US20130228913A1

Electricity

Semiconductor device and method of manufacturing the same

#17 | 2013-02-14

US20130037947A1

Electricity

Semiconductor device and method of manufacturing the same

#18 | 2012-05-31

US20120133045A1

Electricity

Semiconductor device and method of manufacturing the same

#19 | 2011-11-03

US20110269273A1

Electricity

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

#20 | 2010-07-29

US20100187679A1

Electricity

Semiconductor device and method of manufacturing the same

#21 | 2009-07-09

US20090174065A1

Electricity

Semiconductor device and method of manufacturing the same

#22 | 2008-11-06

US20080274590A1

Electricity

Manufacturing method of semiconductor device

#23 | 2006-11-02

US20060244128A1

Electricity

Semiconductor device and method of manufacturing the same

#24 | 2006-08-03

US20060169365A1

Chemistry; metallurgy

High strength cold rolled steel sheet and method for manufacturing the same

#25 | 2006-06-22

US20060134832A1

Electricity

Manufacturing method of semiconductor device

#26 | 2006-01-10

US9635902

Semiconductor device having densely stacked semiconductor chips

#27 | 2006-01-03

US10652039

Semiconductor device having a plurality of laminated semiconductor elements with water absorbing resin films interposed therebetween

InventorID:

85352 ⎘