Inventor profile of:

Hiroshi Kimura

City:

Tokyo

Country:

Japan

Published Applications:

15

Last publication date:

2020-04-02

Top Assignees for applications by Hiroshi Kimura

The entities that hold a legal rights for patent applications filed by inventor Kimura Hiroshi:

Recent patent applications by Kimura Hiroshi

Hiroshi Kimura from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2020-04-02
US20200102373A1
Chemistry; metallurgy

SCFV'S FOR LIVE CELL IMAGING AND OTHER USES

#2 | 2020-01-09
US20200010853A1
Chemistry; metallurgy

Method for inserting desired DNA fragment into site located adjacent to binding domain of DNA-binding protein

#3 | 2020-01-02
US20200002947A1
Fixed constructions

STRANDED CABLE WEDGE

#4 | 2019-02-14
US20190048414A1
Chemistry; metallurgy

METHOD FOR DETERMINING NUCLEIC ACID SEQUENCE OF TARGET GENE

#5 | 2017-12-07
US20170349789A1
Chemistry; metallurgy

Sheet adhesive and adhesion process using the same

#6 | 2017-11-30
US20170343078A1
Mechanical engineering

End fixing structure of composite wire rod

#7 | 2016-08-18
US20160237615A1
Textiles; paper

End fixing structure of composite wire rod

#8 | 2016-07-28
US20160215781A1
Mechanical engineering

ELECTRIC REGENERATIVE TURBOCHARGER

#9 | 2015-08-27
US20150240188A1
Chemistry; metallurgy

Liquid detergent

#10 | 2015-01-29
US20150033213A1
Physics

Compiling method, storage medium and compiling apparatus

#11 | 2014-07-31
US20140212974A1
Chemistry; metallurgy

Cell culture membrane, cell culture substrate, and method for manufacturing cell culture substrate

#12 | 2011-08-11
US20110192132A1
Textiles; paper

Fiber composite twisted cable

#13 | 2011-03-17
US20110064971A1
Performing operations; transporting

Glass substrate manufacturing method, glass substrate polishing method, glass substrate polishing apparatus and glass substrate

#14 | 2007-05-10
US20070102797A1
Electricity

Electrode package for semiconductor device

#15 | 2005-08-25
US20050184396A1
Electricity

Electrode package for semiconductor device

InventorID:

854545 ⎘