Campbell, California
United States
27
2026-05-12
The entities that hold a legal rights for patent applications filed by inventor DANEMAN Michael Julian:
Michael Julian DANEMAN from Campbell, US has applied for patents for these inventions. The list has both pending applications and granted patents:
MEMS with over-voltage protection
#2 | 2026-02-17Laterally-doped MEMS resonator with piezoelectric layer
#3 | 2025-08-21LATERALLY-DOPED MEMS RESONATOR WITH PIEZOELECTRIC LAYER
#4 | 2025-07-24MEMS cavity with non-contaminating seal
#5 | 2025-07-08MEMS with small-molecule barricade
#6 | 2023-09-14MEMS cavity with non-contaminating seal
#7 | 2023-08-22MEMS with small-molecule barricade
#8 | 2023-08-08MEMS with small-molecule barricade
#9 | 2022-05-26MEMS cavity with non-contaminating seal
#10 | 2022-04-26MEMS with over-voltage protection
#11 | 2020-12-17MEMS cavity with non-contaminating seal
#12 | 2020-11-12OPERATING A TWO-DIMENSIONAL ARRAY OF ULTRASONIC TRANSDUCERS
#13 | 2020-10-13MEMS with small-molecule barricade
#14 | 2020-08-11MEMS with over-voltage protection
#15 | 2018-09-13MEMS cavity with non-contaminating seal
#16 | 2017-11-09Operating a two-dimensional array of ultrasonic transducers
#17 | 2016-06-16Integrated CMOS back cavity acoustic transducer and the method of producing the same
#18 | 2016-03-24Method for MEMS structure with dual-level structural layer and acoustic port
#19 | 2016-02-04MEMS device and process for RF and low resistance applications
#20 | 2015-11-26Internal electrical contact for enclosed MEMS devices
#21 | 2015-09-24Differential sensing acoustic sensor
#22 | 2015-04-16Integrated CMOS back cavity acoustic transducer and the method of producing the same
#23 | 2014-11-27Internal electrical contact for enclosed MEMS devices
#24 | 2014-09-18MEMS acoustic sensor with integrated back cavity
#25 | 2014-09-18Integrated structure with bidirectional vertical actuation
#26 | 2014-08-28Method for MEMS structure with dual-level structural layer and acoustic port
#27 | 2014-07-31Internal electrical contact for enclosed MEMS devices
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