Weide Liu

City:

Shanghai

Country:

China

Published Applications:

Last publication date:

2015-10-29

Top Assignees for applications by Weide Liu

The entities that hold a legal rights for patent applications filed by inventor Liu Weide:

Weide Liu from Shanghai, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

Conductive Resilient Hollow Microsphere, Adhesive Composition, and Adhesive Articles

Hydrophilic coatings, articles, coating compositions, and methods

ELECTROMAGNETIC SHIELDING GASKET AND MANUFACTURE METHOD THEREOF

InventorID:

858889 ⎘