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Inventor profile of:

Chih CHEN

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2024-01-18

Top Assignees for applications by Chih CHEN

The entities that hold a legal rights for patent applications filed by inventor CHEN Chih:

National Chiao Tung University 13 Hsinchu, Taiwan
National Yang Ming Chiao Tung University 7 Hsinchu, Taiwan
NATIONAL CHIAO TUNG UNIVERSITY 6 HSINCHU CITY, Taiwan
National Chiao Tung University 1 , Taiwan
NATIONAL CHIAO TUNG UNIVERSITY 1 HSINCHU 300, Taiwan
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 1 Hsinchu, Taiwan
National Yang Ming Chiao Tung University 1 Hsinchu City, Taiwan

Recent patent applications by CHEN Chih

Chih CHEN from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-01-18

US20240021549A1

Electricity

Connector and method for forming the same

#2 | 2023-07-13

US20230220517A1

Chemistry; metallurgy

Nano-twinned Cu—Ni alloy layer and method for manufacturing the same

#3 | 2022-12-08

US20220392049A1

Physics

Auxiliary prediction system for predicting reliability, and method and computer program product thereof

#4 | 2022-09-08

US20220282389A1

Chemistry; metallurgy

Nano-twinned copper layer with doped metal element, substrate comprising the same and method for preparing the same

#5 | 2022-01-27

US20220025550A1

Chemistry; metallurgy

Large grain quasi-single-crystal film and manufacturing method thereof

#6 | 2021-12-30

US20210407960A1

Electricity

Electrical connecting structure having nano-twins copper

#7 | 2021-02-04

US20210032774A1

Chemistry; metallurgy

Quasi-single-crystal film and manufacturing method thereof

#8 | 2021-01-21

US20210020599A1

Electricity

Electrical connecting structure having nano-twins copper and method of forming the same

#9 | 2017-11-09

US20170321339A1

Chemistry; metallurgy

Preferably oriented nanotwinned Au film, method of preparing the same, and bonding structure comprising the same

#10 | 2016-12-08

US20160355940A1

Chemistry; metallurgy

Electrodeposited nano-twins copper layer and method of fabricating the same

#11 | 2016-06-16

US20160168746A1

Chemistry; metallurgy

Copper film with large grains, copper clad laminate having the same and manufacturing method of copper clad laminate

#12 | 2016-02-18

US20160046099A1

Performing operations; transporting

Preferably oriented nanotwinned Au film, method of preparing the same, and bonding structure comprising the same

#13 | 2014-08-07

US20140217593A1

Electricity

Electrical Connecting Element and Method for Manufacturing the Same

#14 | 2014-04-17

US20140103501A1

Electricity

Circuit board with twinned CU circuit layer and method for manufacturing the same

#15 | 2014-04-03

US20140090880A1

Electricity

Electrical connecting element having nano-twinned copper, method of fabricating the same, and electrical connecting structure comprising the same

#16 | 2013-11-14

US20130302646A1

Electricity

Electric connecting structure comprising preferred oriented CuSngrains and method for fabricating the same

#17 | 2013-05-16

US20130122326A1

Chemistry; metallurgy

Electrodeposited nano-twins copper layer and method of fabricating the same

#18 | 2013-02-14

US20130037940A1

Chemistry; metallurgy

Method for inhibiting growth of intermetallic compounds

#19 | 2013-01-10

US20130009072A1

Electricity

Specimen box for electron microscope

#20 | 2013-01-10

US20130009071A1

Electricity

Specimen box for electron microscope

#21 | 2011-02-24

US20110042782A1

Electricity

On-chip inductor structure and method for manufacturing the same

InventorID:

859778 ⎘