Cary, North Carolina
United States
15
2020-03-05
The entities that hold a legal rights for patent applications filed by inventor Sherrer David:
David Sherrer from Cary, US has applied for patents for these inventions. The list has both pending applications and granted patents:
THREE-DIMENSIONAL MICROSTRUCTURES
#2 | 2020-01-16SUBSTRATE-FREE INTERCONNECTED ELECTRONIC MECHANICAL STRUCTURAL SYSTEMS
#3 | 2019-12-26STRUCTURES AND METHODS FOR INTERCONNECTS AND ASSOCIATED ALIGNMENT AND ASSEMBLY MECHANISMS FOR AND BETWEEN CHIPS, COMPONENTS, AND 3D SYSTEMS
#4 | 2018-05-31Substrate-free interconnected electronic mechanical structural systems
#5 | 2018-05-03Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems
#6 | 2018-03-08Three-dimensional microstructures
#7 | 2017-11-23Multilayer build processes and devices thereof
#8 | 2016-11-17Three-dimensional microstructures
#9 | 2016-10-06Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems
#10 | 2016-07-28MICROFLUIDIC CHANNELS FOR THERMAL MANAGEMENT OF MICROELECTRONICS
#11 | 2016-07-28MULTILAYER BUILD PROCESSES AND DEVICES THEREOF
#12 | 2016-07-07Substrate-free interconnected electronic mechanical structural systems
#13 | 2016-02-04High frequency power combiner/divider
#14 | 2015-12-31Three-dimensional microstructures
#15 | 2014-08-07Three-dimensional microstructures
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