Inventor profile of:

Fen Chen

City:

Williston, Vermont

Country:

United States

Published Applications:

71

Last publication date:

2020-02-13

Top Assignees for applications by Fen Chen

The entities that hold a legal rights for patent applications filed by inventor Chen Fen:

Recent patent applications by Chen Fen

Fen Chen from Williston, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2020-02-13
US20200049651A1
Physics

Moisture detection and ingression monitoring systems and methods of manufacture

#2 | 2020-01-28
US16394436
Physics

Moisture detection and ingression monitoring systems and methods of manufacture

#3 | 2019-08-15
US20190250116A1
Physics

Moisture detection and ingression monitoring systems and methods of manufacture

#4 | 2018-12-13
US20180356359A1
Physics

Moisture detection and ingression monitoring systems and methods of manufacture

#5 | 2018-12-13
US20180356358A1
Physics

Moisture detection and ingression monitoring systems and methods of manufacture

#6 | 2018-03-15
US20180074111A1
Physics

Electromigration monitor

#7 | 2018-03-15
US20180074110A1
Physics

Electromigration monitor

#8 | 2018-02-22
US20180053734A1
Electricity

Semiconductor chip with anti-reverse engineering function

#9 | 2017-09-14
US20170263574A1
Electricity

Semiconductor chip with anti-reverse engineering function

#10 | 2017-03-23
US20170084552A1
Electricity

Semiconductor chip with anti-reverse engineering function

#11 | 2016-12-08
US20160358821A1
Electricity

Thru-silicon-via structures

#12 | 2016-11-10
US20160327502A1
Physics

Moisture detection and ingression monitoring systems and methods of manufacture

#13 | 2016-10-06
US20160291084A1
Physics

Via leakage and breakdown testing

#14 | 2016-09-08
US20160258998A1
Physics

Electromigration testing of interconnect analogues having bottom-connected sensory pins

#15 | 2016-08-04
US20160225919A1
Electricity

DEVICE STRUCTURE WITH NEGATIVE RESISTANCE CHARACTERISTICS

#16 | 2016-05-26
US20160148863A1
Electricity

NON-CONTIGUOUS DUMMY STRUCTURE SURROUNDING THROUGH-SUBSTRATE VIA NEAR INTEGRATED CIRCUIT WIRES

#17 | 2016-03-10
US20160071790A1
Electricity

Wiring structures

#18 | 2016-02-04
US20160035621A1
Electricity

Copper wire and dielectric with air gaps

#19 | 2015-12-31
US20150380326A1
Electricity

Electromigration monitor

#20 | 2015-09-17
US20150262911A1
Electricity

TSV WITH END CAP, METHOD AND 3D INTEGRATED CIRCUIT

#21 | 2015-08-06
US20150221567A1
Electricity

ALTERNATING OPEN-ENDED VIA CHAINS FOR TESTING VIA FORMATION AND DIELECTRIC INTEGRITY

#22 | 2015-07-16
US20150198654A1
Physics

Non-planar field effect transistor test structure and lateral dielectric breakdown testing method

#23 | 2015-07-09
US20150194345A1
Electricity

Semiconductor chip with a dual damascene wire and through-substrate via (TSV) structure

#24 | 2015-05-21
US20150137375A1
Electricity

Copper wire and dielectric with air gaps

#25 | 2015-05-21
US20150137374A1
Electricity

Copper wire and dielectric with air gaps

#26 | 2015-04-30
US20150115982A1
Physics

Structures and methods for monitoring dielectric reliability with through-silicon vias

#27 | 2015-04-30
US20150115460A1
Electricity

Integrated circuit structure with through-semiconductor via

#28 | 2015-04-30
US20150115459A1
Electricity

Integrated circuit structure with metal cap and methods of fabrication

#29 | 2014-11-20
US20140339558A1
Electricity

Alternating open-ended via chains for testing via formation and dielectric integrity

#30 | 2014-05-01
US20140117420A1
Electricity

Semiconductor structure incorporating a contact sidewall spacer with a self-aligned airgap and a method of forming the semiconductor structure

#31 | 2014-01-02
US20140001599A1
Electricity

Semiconductor structure with thin film resistor and terminal bond pad

#32 | 2013-11-28
US20130314119A1
Electricity

Testing structure and method of using the testing structure

#33 | 2013-10-03
US20130258765A1
Physics

Method of changing reflectance or resistance of a region in an optoelectronic memory device

#34 | 2013-07-25
US20130191047A1
Electricity

On-chip poly-to-contact process monitoring and reliability evaluation system and method of use

#35 | 2013-06-27
US20130164905A1
Electricity

3D via capacitor with a floating conductive plate for improved reliability

#36 | 2013-06-27
US20130161791A1
Electricity

3D via capacitor with a floating conductive plate for improved reliability

#37 | 2013-06-13
US20130146940A1
Electricity

Structure including voltage controlled negative resistance

#38 | 2013-05-02
US20130106452A1
Physics

Real-time on-chip EM performance monitoring

#39 | 2013-02-28
US20130049793A1
Physics

Analyzing EM performance during IC manufacturing

#40 | 2013-02-14
US20130038334A1
Physics

Test structure, method and circuit for simultaneously testing time dependent dielectric breakdown and electromigration or stress migration

#41 | 2012-11-29
US20120299188A1
Electricity

Wiring structure and method of forming the structure

#42 | 2012-11-15
US20120287707A1
Physics

OPTOELECTRONIC MEMORY DEVICES

#43 | 2012-10-18
US20120261724A1
Electricity

Stackable programmable passive device and a testing method

#44 | 2012-08-30
US20120218030A1
Electricity

Method for managing circuit reliability

#45 | 2012-04-05
US20120080771A1
Electricity

3D via capacitor with a floating conductive plate for improved reliability

#46 | 2012-02-16
US20120038037A1
Electricity

Semiconductor structures and methods of manufacture

#47 | 2012-01-19
US20120015511A1
Electricity

On-chip embedded thermal antenna for chip cooling

#48 | 2010-11-18
US20100290264A1
Physics

Optoelectronic memory devices

#49 | 2010-10-14
US20100258900A1
Electricity

On-chip embedded thermal antenna for chip cooling

#50 | 2010-07-22
US20100184280A1
Electricity

Method of forming metal ion transistor

#51 | 2010-06-24
US20100155893A1
Electricity

Method for forming thin film resistor and terminal bond pad simultaneously

#52 | 2010-06-03
US20100133691A1
Electricity

Thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperature

#53 | 2010-01-28
US20100019330A1
Electricity

Device structures with a self-aligned damage layer and methods for forming such device structures

#54 | 2009-08-27
US20090212431A1
Electricity

Method of making thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperature

#55 | 2009-06-11
US20090146242A1
Electricity

Metal ion transistor

#56 | 2009-04-30
US20090107220A1
Physics

Design structure for an on-chip real-time moisture sensor for and method of detecting moisture ingress in an integrated circuit chip

#57 | 2009-01-01
US20090006014A1
Electricity

Non-Destructive Electrical Characterization Macro and Methodology for In-Line Interconnect Spacing Monitoring

#58 | 2008-09-25
US20080232159A1
Physics

Phase-change TaN resistor based triple-state/multi-state read only memory

#59 | 2008-08-21
US20080197337A1
Physics

Phase-change TaN resistor based triple-state/multi-state read only memory

#60 | 2008-08-14
US20080191716A1
Physics

On-Chip Real-Time Moisture Sensor For and Method of Detecting Moisture Ingress in an Integrated Circuit Chip

#61 | 2008-07-24
US20080173975A1
Electricity

PROGRAMMABLE RESISTOR, SWITCH OR VERTICAL MEMORY CELL

#62 | 2008-03-13
US20080061902A1
Electricity

Method and apparatus for impedance matching in transmission circuits using tantalum nitride resistor devices

#63 | 2008-01-03
US20080001620A1
Electricity

Method and apparatus for impedance matching in transmission circuits using tantalum nitride resistor devices

#64 | 2007-06-07
US20070130551A1
Electricity

Non-destructive evaluation of microstructure and interface roughness of electrically conducting lines in semiconductor integrated circuits in deep sub-micron regime

#65 | 2007-05-10
US20070103228A1
Electricity

Stackable programmable passive device and a testing method

#66 | 2007-03-08
US20070051875A1
Physics

Optoelectronic memory devices

#67 | 2007-02-01
US20070023743A1
Physics

Phase-change TaN resistor based triple-state/multi-state read only memory

#68 | 2006-11-30
US20060267144A1
Electricity

Trench type buried on-chip precision programmable resistor

#69 | 2006-07-27
US20060163685A1
Electricity

Thermo-mechanical cleavable structure

#70 | 2006-04-06
US20060071676A1
Electricity

Determination of grain sizes of electrically conductive lines in semiconductor integrated circuits

#71 | 2005-12-01
US20050263850A1
Electricity

Trench type buried on-chip precision programmable resistor

InventorID:

86059 ⎘