Williston, Vermont
United States
71
2020-02-13
The entities that hold a legal rights for patent applications filed by inventor Chen Fen:
Fen Chen from Williston, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Moisture detection and ingression monitoring systems and methods of manufacture
#2 | 2020-01-28Moisture detection and ingression monitoring systems and methods of manufacture
#3 | 2019-08-15Moisture detection and ingression monitoring systems and methods of manufacture
#4 | 2018-12-13Moisture detection and ingression monitoring systems and methods of manufacture
#5 | 2018-12-13Moisture detection and ingression monitoring systems and methods of manufacture
#6 | 2018-03-15Electromigration monitor
#7 | 2018-03-15Electromigration monitor
#8 | 2018-02-22Semiconductor chip with anti-reverse engineering function
#9 | 2017-09-14Semiconductor chip with anti-reverse engineering function
#10 | 2017-03-23Semiconductor chip with anti-reverse engineering function
#11 | 2016-12-08Thru-silicon-via structures
#12 | 2016-11-10Moisture detection and ingression monitoring systems and methods of manufacture
#13 | 2016-10-06Via leakage and breakdown testing
#14 | 2016-09-08Electromigration testing of interconnect analogues having bottom-connected sensory pins
#15 | 2016-08-04DEVICE STRUCTURE WITH NEGATIVE RESISTANCE CHARACTERISTICS
#16 | 2016-05-26NON-CONTIGUOUS DUMMY STRUCTURE SURROUNDING THROUGH-SUBSTRATE VIA NEAR INTEGRATED CIRCUIT WIRES
#17 | 2016-03-10Wiring structures
#18 | 2016-02-04Copper wire and dielectric with air gaps
#19 | 2015-12-31Electromigration monitor
#20 | 2015-09-17TSV WITH END CAP, METHOD AND 3D INTEGRATED CIRCUIT
#21 | 2015-08-06ALTERNATING OPEN-ENDED VIA CHAINS FOR TESTING VIA FORMATION AND DIELECTRIC INTEGRITY
#22 | 2015-07-16Non-planar field effect transistor test structure and lateral dielectric breakdown testing method
#23 | 2015-07-09Semiconductor chip with a dual damascene wire and through-substrate via (TSV) structure
#24 | 2015-05-21Copper wire and dielectric with air gaps
#25 | 2015-05-21Copper wire and dielectric with air gaps
#26 | 2015-04-30Structures and methods for monitoring dielectric reliability with through-silicon vias
#27 | 2015-04-30Integrated circuit structure with through-semiconductor via
#28 | 2015-04-30Integrated circuit structure with metal cap and methods of fabrication
#29 | 2014-11-20Alternating open-ended via chains for testing via formation and dielectric integrity
#30 | 2014-05-01Semiconductor structure incorporating a contact sidewall spacer with a self-aligned airgap and a method of forming the semiconductor structure
#31 | 2014-01-02Semiconductor structure with thin film resistor and terminal bond pad
#32 | 2013-11-28Testing structure and method of using the testing structure
#33 | 2013-10-03Method of changing reflectance or resistance of a region in an optoelectronic memory device
#34 | 2013-07-25On-chip poly-to-contact process monitoring and reliability evaluation system and method of use
#35 | 2013-06-273D via capacitor with a floating conductive plate for improved reliability
#36 | 2013-06-273D via capacitor with a floating conductive plate for improved reliability
#37 | 2013-06-13Structure including voltage controlled negative resistance
#38 | 2013-05-02Real-time on-chip EM performance monitoring
#39 | 2013-02-28Analyzing EM performance during IC manufacturing
#40 | 2013-02-14Test structure, method and circuit for simultaneously testing time dependent dielectric breakdown and electromigration or stress migration
#41 | 2012-11-29Wiring structure and method of forming the structure
#42 | 2012-11-15OPTOELECTRONIC MEMORY DEVICES
#43 | 2012-10-18Stackable programmable passive device and a testing method
#44 | 2012-08-30Method for managing circuit reliability
#45 | 2012-04-053D via capacitor with a floating conductive plate for improved reliability
#46 | 2012-02-16Semiconductor structures and methods of manufacture
#47 | 2012-01-19On-chip embedded thermal antenna for chip cooling
#48 | 2010-11-18Optoelectronic memory devices
#49 | 2010-10-14On-chip embedded thermal antenna for chip cooling
#50 | 2010-07-22Method of forming metal ion transistor
#51 | 2010-06-24Method for forming thin film resistor and terminal bond pad simultaneously
#52 | 2010-06-03Thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperature
#53 | 2010-01-28Device structures with a self-aligned damage layer and methods for forming such device structures
#54 | 2009-08-27Method of making thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperature
#55 | 2009-06-11Metal ion transistor
#56 | 2009-04-30Design structure for an on-chip real-time moisture sensor for and method of detecting moisture ingress in an integrated circuit chip
#57 | 2009-01-01Non-Destructive Electrical Characterization Macro and Methodology for In-Line Interconnect Spacing Monitoring
#58 | 2008-09-25Phase-change TaN resistor based triple-state/multi-state read only memory
#59 | 2008-08-21Phase-change TaN resistor based triple-state/multi-state read only memory
#60 | 2008-08-14On-Chip Real-Time Moisture Sensor For and Method of Detecting Moisture Ingress in an Integrated Circuit Chip
#61 | 2008-07-24PROGRAMMABLE RESISTOR, SWITCH OR VERTICAL MEMORY CELL
#62 | 2008-03-13Method and apparatus for impedance matching in transmission circuits using tantalum nitride resistor devices
#63 | 2008-01-03Method and apparatus for impedance matching in transmission circuits using tantalum nitride resistor devices
#64 | 2007-06-07Non-destructive evaluation of microstructure and interface roughness of electrically conducting lines in semiconductor integrated circuits in deep sub-micron regime
#65 | 2007-05-10Stackable programmable passive device and a testing method
#66 | 2007-03-08Optoelectronic memory devices
#67 | 2007-02-01Phase-change TaN resistor based triple-state/multi-state read only memory
#68 | 2006-11-30Trench type buried on-chip precision programmable resistor
#69 | 2006-07-27Thermo-mechanical cleavable structure
#70 | 2006-04-06Determination of grain sizes of electrically conductive lines in semiconductor integrated circuits
#71 | 2005-12-01Trench type buried on-chip precision programmable resistor
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