Tokyo
Japan
26
2023-12-28
The entities that hold a legal rights for patent applications filed by inventor Sato Hidekazu:
Hidekazu Sato from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
MULTILAYER COIL COMPONENT
#2 | 2023-01-05Electronic component
#3 | 2022-09-01MULTILAYER COIL COMPONENT
#4 | 2022-08-18LAMINATED COIL COMPONENT
#5 | 2022-03-03Electronic component
#6 | 2020-07-23MULTILAYER COIL COMPONENT
#7 | 2020-07-23Multilayer coil component
#8 | 2020-04-30Multilayer coil component
#9 | 2020-04-16Electronic component
#10 | 2019-11-14Electronic component
#11 | 2019-06-27Multilayer coil electronic component
#12 | 2019-06-27Glass ceramics sintered body and coil electronic component
#13 | 2019-03-28Multilayer coil component
#14 | 2018-08-16Glass ceramics sintered body and coil electronic component
#15 | 2018-08-02Multilayer coil component
#16 | 2018-05-17Electronic component
#17 | 2017-12-21Soft magnetic metal powder, soft magnetic metal fired body, and coil type electronic device
#18 | 2017-11-16Multilayer coil component
#19 | 2017-10-26Electronic component
#20 | 2017-09-28VIBRATION DAMPING DEVICE FOR STRUCTURE
#21 | 2017-01-26Composite electronic device
#22 | 2016-08-11Glass ceramic composition and coil electronic component
#23 | 2014-08-07Dielectric ceramic composition, electronic element, and composite electric element
#24 | 2010-05-06Method for producing multilayer inductor
#25 | 2007-03-20Method and apparatus for setting communication parameter in information terminal
#26 | 2006-01-12Coil component
862807 ⎘