Tetsuya Tsukada

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2026-03-12

Top Assignees for applications by Tetsuya Tsukada

The entities that hold a legal rights for patent applications filed by inventor Tsukada Tetsuya:

Toppan Printing Co., Ltd. 6 Tokyo, Japan
TOPPAN INC. 2 Tokyo, Japan
TOPPAN Holdings Inc. 1 Tokyo, Japan

Recent patent applications by Tsukada Tetsuya

Tetsuya Tsukada from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-03-12

US20260073175A1

Physics

IC MODULES AND IC CARDS

#2 | 2023-08-17

US20230259734A1

Physics

IC card and method for manufacturing IC card

#3 | 2023-04-13

US20230111259A1

Physics

Card-type media

#4 | 2019-09-19

US20190286967A1

Physics

Dual IC cards and antenna sheets

#5 | 2019-08-29

US20190266469A1

Physics

Electromagnetic-coupling dual IC card and IC module

#6 | 2019-05-16

US20190147314A1

Physics

Dual IC card

#7 | 2016-04-14

US20160104065A1

Physics

Dual IC card

#8 | 2016-04-14

US20160104064A1

Physics

IC module, dual IC card, and method for manufacturing IC module

#9 | 2014-08-14

US20140224886A1

Physics

Composite IC card

InventorID:

868419 ⎘