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Inventor profile of:

Haidong Wang

City:

Beijing

Country:

China

Published Applications:

Last publication date:

2024-09-19

Top Assignees for applications by Haidong Wang

The entities that hold a legal rights for patent applications filed by inventor Wang Haidong:

BOE TECHNOLOGY GROUP CO., LTD. 5 Beijing, China
HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD. 2 Hefei, Anhui, China
Ordos Yuansheng Optoelectronics Co., Ltd. 2 Inner Mongolia, China
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP 1 Houston, TX United States
Tsinghua University 1 Beijing, China
Ordos Yuansheng Optoelectronics Co., Ltd. 1 Inner Magnolia, China
HANGZHOU H3C TECHNOLOGIES CO., LTD. 1 Zhejiang, China
Hangzhou H3C Technologies Co., Ltd. 1 Hangzhou, China

Recent patent applications by Wang Haidong

Haidong Wang from Beijing, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-09-19

US20240315089A1

Electricity

DISPLAY APPARATUS, AND DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR

#2 | 2024-09-19

US20240311760A1

Physics

METHOD, APPARATUS, ELECTRONIC DEVICE, AND STORAGE MEDIUM FOR CONTROLLING USER STATE

#3 | 2024-06-20

US20240204190A1

Electricity

DIFFERENTIAL SUSPENDED SINGLE-LAYER GRAPHENE NANOPORE SENSOR, AND PREPARATION METHOD THEREFOR AND USE THEREOF

#4 | 2024-03-21

US20240099057A1

Electricity

LIGHT-EMITTING PANEL AND PREPARATION METHOD THEREFOR, AND LIGHT-EMITTING APPARATUS

#5 | 2023-01-19

US20230018774A1

Electricity

Display substrate, manufacturing method thereof, and display device

#6 | 2021-05-27

US20210159364A1

Electricity

Array substrate, display panel and display device

#7 | 2021-05-27

US20210157185A1

Physics

Array substrate, display panel including the same, and display device

#8 | 2021-04-15

US20210108911A1

Physics

Raman spectroscopy method for simultaneously measuring temperature and thermal stress of two-dimensional film material in situ

#9 | 2015-11-19

US20150334003A1

Electricity

Network apparatus and method for communication between different components

#10 | 2014-08-14

US20140226679A1

Electricity

METHOD FOR BUNDLING CROSS-BOARD MULTILINK PROTOCOL

#11 | 2010-01-14

US20100011139A1

Electricity

Network apparatus and method for communication between different components

InventorID:

870165 ⎘