William J. Boardman

City:

Danville, California

Country:

United States

Published Applications:

Last publication date:

2014-08-14

Top Assignees for applications by William J. Boardman

The entities that hold a legal rights for patent applications filed by inventor Boardman William J.:

Sub-One Technology, Inc. 4 Pleasanton, CA United States
Sub-One Technology 1 Pleasanton, CA United States
SUB-ONE TECHNOLOGY, LLC. 1 Tucson, AZ United States

Recent patent applications by Boardman William J.

William J. Boardman from Danville, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-08-14

US20140227464A1

Chemistry; metallurgy

Multiple anode plasma for CVD in a hollow article

#2 | 2011-06-23

US20110151141A1

Electricity

Chemical vapor deposition for an interior of a hollow article with high aspect ratio

#3 | 2009-12-17

US20090311443A1

Chemistry; metallurgy

Method of coating inner and outer surfaces of pipes for thermal solar and other applications

#4 | 2009-07-09

US20090176035A1

Chemistry; metallurgy

Method for producing diamond-like carbon coatings using PECVD and diamondoid precursors on internal surfaces of a hollow component

#5 | 2009-03-12

US20090065056A1

Electricity

HYBRID PHOTOVOLTAICALLY ACTIVE LAYER AND METHOD FOR FORMING SUCH A LAYER

#6 | 2009-01-29

US20090029067A1

Chemistry; metallurgy

METHOD FOR PRODUCING AMORPHOUS CARBON COATINGS ON EXTERNAL SURFACES USING DIAMONDOID PRECURSORS

#7 | 2009-01-15

US20090017230A1

Chemistry; metallurgy

Corrosion-resistant internal coating method using a germanium-containing precursor and hollow cathode techniques

InventorID:

871181 ⎘