Richardson, Texas
United States
15
2026-01-15
The entities that hold a legal rights for patent applications filed by inventor Dumka Deep C.:
Deep C. Dumka from Richardson, US has applied for patents for these inventions. The list has both pending applications and granted patents:
MOISTURE RESISTIVE FLIP-CHIP BASED MODULE
#2 | 2023-06-29Method for packaging an integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL)
#3 | 2023-06-22Semiconductor chip suitable for 2.5D and 3D packaging integration and methods of forming the same
#4 | 2023-06-08BACKSIDE METALLIZATION FOR SEMICONDUCTOR ASSEMBLY
#5 | 2022-01-27Semiconductor chip suitable for 2.5D and 3D packaging integration and methods of forming the same
#6 | 2021-06-17Integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL)
#7 | 2021-04-01Semiconductor chip suitable for 2.5D and 3D packaging integration and methods of forming the same
#8 | 2021-04-01Semiconductor chip suitable for 2.5D and 3D packaging integration and methods of forming the same
#9 | 2019-11-07Module assembly
#10 | 2018-05-03Module assembly
#11 | 2016-06-02Package for high-power semiconductor devices
#12 | 2016-05-10Gallium nitride on high thermal conductivity material device and method
#13 | 2015-04-16PACKAGE FOR HIGH-POWER SEMICONDUCTOR DEVICES
#14 | 2014-08-21Package for high-power semiconductor devices
#15 | 2010-10-14Field effect transistor having a plurality of field plates
876530 ⎘