Luc Dallaserra

City:

Paris

Country:

France

Published Applications:

Last publication date:

2024-02-29

Top Assignees for applications by Luc Dallaserra

The entities that hold a legal rights for patent applications filed by inventor Dallaserra Luc:

Luc Dallaserra from Paris, FR has applied for patents for these inventions. The list has both pending applications and granted patents:

INTERLAYER HEAT SINK FOR COOLING SYSTEM OF AN ELECTRONIC CARD OF A SUPERCOMPUTER

OUTLET HEAT SINK FOR COOLING SYSTEM OF A SUPERCOMPUTER ELECTRONIC BOARD

INLET HEAT SINK FOR A COOLING SYSTEM OF A SUPERCOMPUTER ELECTRONIC BOARD

System and method for connecting at least one electronic card to a printed circuit board

Heatsink for multiple memory modules

Dissipating interconnection module for M.2 form factor expansion card

Floor-loading load-spreading system for computer cabinet

Electronic board provided with a liquid cooling system

InventorID:

877950 ⎘