Wuhan
China
44
2026-03-12
The entities that hold a legal rights for patent applications filed by inventor CHEN Peng:
Peng CHEN from Wuhan, CN has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF AND SEMICONDUCTOR DEVICE
#2 | 2026-03-12ELECTROMAGNETIC INTERFERENCE SHIELDING PACKAGE STRUCTURES AND FABRICATING METHODS THEREOF
#3 | 2025-07-17SEMICONDUCTOR PACKAGE STRUCTURE WITH GLASS SUBSTRATE AND PACKAGING METHOD THEREOF
#4 | 2025-07-17SHORT PROCESS METHOD FOR EXTRACTING PRECIOUS METALS BY INTEGRATING THIOSULFATE ELECTROCHEMICAL LEACHING AND RECOVERY
#5 | 2025-05-15SEMICONDUCTOR PACKAGING STRUCTURES AND METHODS FOR FORMING THE SAME
#6 | 2025-03-20SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF
#7 | 2025-02-13SEMICONDUCTOR DEVICE, CHIP AND FABRICATION METHOD THEREOF, MEMORY SYSTEM
#8 | 2025-01-30CHIP PACKAGING STRUCTURE, SEMICONDUCTOR STRUCTURE, AND FABRICATING METHOD THEREOF
#9 | 2025-01-16FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME
#10 | 2025-01-16FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME
#11 | 2025-01-09LASER SYSTEM FOR DICING SEMICONDUCTOR STRUCTURE AND OPERATION METHOD THEREOF
#12 | 2025-01-09LASER SYSTEM FOR DICING SEMICONDUCTOR STRUCTURE AND OPERATION METHOD THEREOF
#13 | 2024-11-14PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF, MEMORY SYSTEM AND ELECTRONIC APPARATUS
#14 | 2024-10-24WORKPIECE TAPE REMOVING
#15 | 2024-10-03SEMICONDUCTOR PACKAGE STRUCTURE, FABRICATION METHOD AND MEMORY SYSTEM
#16 | 2024-10-03INTEGRATED PACKAGE DEVICE, FABRICATION METHOD THEREOF AND MEMORY SYSTEM
#17 | 2024-09-19SEMICONDUCTOR DEVICE, FABRICATING METHOD, MEMORY DEVICE AND DEVICE SYSTEM
#18 | 2024-08-29CHIP PACKAGE STRUCTURE AND MANUFACTURING METHODS FOR THE SAME
#19 | 2024-05-30MEMORY SYSTEM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#20 | 2024-04-25METHOD FOR PREDICTING EVOLUTION LAW OF ROCK MECHANICAL STRATUM OF FRACTURED RESERVOIR
#21 | 2023-10-26Semiconductor package structure and packaging method thereof
#22 | 2023-08-31Chip package structure and manufacturing method thereof
#23 | 2023-08-24SUBSTRATE STRUCTURE, AND FABRICATION AND PACKAGING METHODS THEREOF
#24 | 2023-06-29MEMORY SYSTEM PACKAGING STRUCTURE, AND METHOD FOR FORMING THE SAME
#25 | 2022-12-08ELECTROMAGNETIC INTERFERENCE SHIELDING PACKAGE STRUCTURES AND FABRICATING METHODS THEREOF
#26 | 2022-10-06Laser dicing system and method for dicing semiconductor structure including cutting street
#27 | 2022-10-06Laser system for dicing semiconductor structure and operation method thereof
#28 | 2022-09-01Semiconductor package structure and packaging method thereof
#29 | 2022-08-11Flip-chip stacking structures and methods for forming the same
#30 | 2022-07-28Substrate structure, and fabrication and packaging methods thereof
#31 | 2022-05-19Method for processing semiconductor wafers
#32 | 2022-01-13IC PACKAGE
#33 | 2022-01-06Method and device for wafer taping
#34 | 2021-12-09Chip package structure and manufacturing method thereof
#35 | 2021-06-03Chip package structure with stacked chips and manufacturing method thereof
#36 | 2021-03-18Electronic component comprising substrate with thermal indicator
#37 | 2020-12-03Selective laser sintering device
#38 | 2020-10-22Manufacturing method of integrated circuit packaging structure
#39 | 2020-08-27Method and device for wafer taping
#40 | 2020-04-30IC PACKAGE
#41 | 2020-04-16Independently temperature-controlled high-temperature selective laser sintering frame structure
#42 | 2020-01-02Sleeping and wake-up methods and apparatuses of master-slave network, and power saving system of master-slave network
#43 | 2017-12-07Sleeping and wake-up methods and apparatuses of master-slave network, and power saving system of master-slave network
#44 | 2013-02-14Solid state thin disk laser
88012 ⎘