Fremont, California
United States
16
2019-08-01
The entities that hold a legal rights for patent applications filed by inventor Eppler Aaron:
Aaron Eppler from Fremont, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Spacer profile control using atomic layer deposition in a multiple patterning process
#2 | 2018-12-27High aspect ratio etch of oxide metal oxide metal stack
#3 | 2017-02-09Systems and Methods for Separately Applying Charged Plasma Constituents and Ultraviolet Light in a Mixed Mode Processing Operation
#4 | 2016-12-22System and method for determining field non-uniformities of a wafer processing chamber using a wafer processing parameter
#5 | 2015-07-16High aspect ratio etch with combination mask
#6 | 2015-03-26High aspect ratio etch with combination mask
#7 | 2014-08-21System, method and apparatus for ion milling in a plasma etch chamber
#8 | 2010-12-30HARDMASK OPEN AND ETCH PROFILE CONTROL WITH HARDMASK OPEN
#9 | 2009-06-16Process for etching dielectric films with improved resist and/or etch profile characteristics
#10 | 2009-06-09Negative bias critical dimension trim
#11 | 2006-10-12Etch profile control
#12 | 2006-06-15Photoresist conditioning with hydrogen ramping
#13 | 2006-04-27Photoresist conditioning with hydrogen ramping
#14 | 2005-07-26Variable temperature processes for tunable electrostatic chuck
#15 | 2005-03-31Etch with ramping
#16 | 2005-02-24Multiple frequency plasma processor method and apparatus
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