MOOSBURG
Germany
7
2024-07-04
The entities that hold a legal rights for patent applications filed by inventor RINCK HELMUT:
HELMUT RINCK from MOOSBURG, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
ETCHING PLATINUM-CONTAINING THIN FILM USING PROTECTIVE CAP LAYER
#2 | 2021-10-07Etching platinum-containing thin film using protective cap layer
#3 | 2020-03-12Etching platinum-containing thin film using protective cap layer
#4 | 2018-08-02METAL BOND PAD WITH COBALT INTERCONNECT LAYER AND SOLDER THEREON
#5 | 2018-07-19Etching platinum-containing thin film using protective cap layer
#6 | 2016-09-29Metal bond pad with cobalt interconnect layer and solder thereon
#7 | 2014-08-28Integrated circuit (IC) having electrically conductive corrosion protecting cap over bond pads
885573 ⎘