Ossining, New York
United States
48
2026-02-19
The entities that hold a legal rights for patent applications filed by inventor Webb Bucknell C.:
Bucknell C. Webb from Ossining, US has applied for patents for these inventions. The list has both pending applications and granted patents:
THERMAL ANNEALING CALIBRATION USING MICROFABRICATED RESISTANCE TEMPERATURE SENSORS
#2 | 2025-05-08LASER ANNEALING QUANTUM DEVICES USING VARIABLE THERMAL PROFILES
#3 | 2021-12-30Selective chemical frequency modification of Josephson junction resonators
#4 | 2021-11-11Method and apparatus of processor wafer bonding for wafer-scale integrated supercomputer
#5 | 2020-12-24Encapsulating in-situ energy storage device with electrode contact
#6 | 2020-12-173D textured composite silicon anode and fluorinated lithium compound electrochemical cell
#7 | 2020-11-10Thermalization structure for cryogenic temperature devices
#8 | 2020-07-02Wearable multiplatform sensor
#9 | 2020-05-07Low-profile battery construct with engineered interfaces
#10 | 2018-05-17Microchip substance delivery devices
#11 | 2018-03-22Wafer level integration including design/co-design, structure process, equipment stress management, and thermal management
#12 | 2018-03-15Chip package for two-phase cooling and assembly process thereof
#13 | 2017-09-07Low-profile battery construct with engineered interfaces
#14 | 2016-05-12Magnetic writer having multiple gaps with more uniform magnetic fields across the gaps
#15 | 2016-03-17Microchip substance delivery devices having low-power electromechanical release mechanisms
#16 | 2016-02-18Wafer level overmold for three dimensional surfaces
#17 | 2015-10-08Thin, flexible microsystem with integrated energy source
#18 | 2015-09-24Volumetric integrated circuit and volumetric integrated circuit manufacturing method
#19 | 2015-03-05Planar inductors with closed magnetic loops
#20 | 2015-03-05PLANAR INDUCTORS WITH CLOSED MAGNETIC LOOPS
#21 | 2014-07-10INDUCTOR WITH LAMINATED YOKE
#22 | 2014-05-08Magnetic writer having multiple gaps with more uniform magnetic fields across the gaps
#23 | 2014-03-06Plated lamination structures for integrated magnetic devices
#24 | 2014-01-30Underfill material dispensing for stacked semiconductor chips
#25 | 2014-01-16Underfill material dispensing for stacked semiconductor chips
#26 | 2013-11-28Inductor with stacked conductors
#27 | 2013-07-11Inductor with laminated yoke
#28 | 2013-05-16Magnetic writer having multiple gaps with more uniform magnetic fields across the gaps
#29 | 2013-05-02INDUCTOR WITH MULTIPLE POLYMERIC LAYERS
#30 | 2013-04-18Semiconductor trench inductors and transformers
#31 | 2013-02-14Pick and place tape release for thin semiconductor dies
#32 | 2012-01-24Thin film inductor with integrated gaps
#33 | 2011-07-14Reworkable electronic device assembly and method
#34 | 2011-05-12Metal oxide semiconductor (MOS)-compatible high-aspect ratio through-wafer vias and low-stress configuration thereof
#35 | 2009-01-29Cooling device with a preformed compliant interface
#36 | 2008-12-04COOLING AN ELECTRONIC DEVICE UTILIZING SPRING ELEMENTS WITH FINS
#37 | 2008-10-30VIA AND SOLDER BALL SHAPES TO MAXIMIZE CHIP OR SILICON CARRIER STRENGTH RELATIVE TO THERMAL OR BENDING LOAD ZERO POINT
#38 | 2008-07-17Cooling structure using rigid movable elements
#39 | 2008-06-19Compliant thermal interface structure utilizing spring elements
#40 | 2008-05-29SILICON CARRIER HAVING INCREASED FLEXIBILITY
#41 | 2007-07-05Silicon carrier having increased flexibility
#42 | 2006-12-14Cooling structure using rigid movable elements
#43 | 2006-12-14Compliant thermal interface structure utilizing spring elements
#44 | 2006-12-14Compliant thermal interface structure utilizing spring elements with fins
#45 | 2006-12-14Compliant thermal interface structure with vapor chamber
#46 | 2006-03-28Self-servo-writing multi-slot timing pattern
#47 | 2005-05-19Method and apparatus for correcting for systematic errors in timing pattern generation
#48 | 2005-01-06Self-servo-writing multi-slot timing pattern
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