Lutz Stamp

City:

Berlin

Country:

Germany

Published Applications:

Last publication date:

2022-05-19

Top Assignees for applications by Lutz Stamp

The entities that hold a legal rights for patent applications filed by inventor Stamp Lutz:

Lutz Stamp from Berlin, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

A METHOD FOR ACTIVATING A SURFACE OF A NON-CONDUCTIVE OR CARBON-FIBRES CONTAINING SUBSTRATE FOR METALLIZATION

Process for depositing a metal or metal alloy on a surface of a substrate including its activation

METHOD FOR TREATMENT OF RECESSED STRUCTURES IN DIELECTRIC MATERIALS FOR SMEAR REMOVAL

Adhesion promoting agents for metallization of substrate surfaces

FORMALDEHYDE-FREE ELECTROLESS COPPER PLATING SOLUTION

Method for metallizing insulating substrates wherein the roughening and etching processes are controlled by means of gloss measurement

Direct electrolytic metallization on non-conducting substrates

InventorID:

888435 ⎘