Jamestown, North Carolina
United States
39
2026-01-15
The entities that hold a legal rights for patent applications filed by inventor Carroll Michael:
Michael Carroll from Jamestown, US has applied for patents for these inventions. The list has both pending applications and granted patents:
WAFER-LEVEL HYBRID BONDED RADIO FREQUENCY CIRCUIT
#2 | 2025-10-09METHOD FOR DEBONDING WAFER
#3 | 2025-10-09SEPARATING CARRIER AND DEVICE WAFER ASSEMBLIES
#4 | 2024-05-09WAFER-LEVEL HYBRID BONDED RF SWITCH WITH REDISTRIBUTION LAYER
#5 | 2023-08-17RF device without silicon handle substrate for enhanced thermal and electrical performance and methods of forming the same
#6 | 2023-05-25RF devices with enhanced performance and methods of forming the same utilizing localized SOI formation
#7 | 2023-03-23RF DEVICES WITH ENHANCED PERFORMANCE AND METHODS OF FORMING THE SAME
#8 | 2023-02-09RF devices with enhanced performance and methods of forming the same
#9 | 2022-05-05RF devices with enhanced performance and methods of forming the same
#10 | 2022-04-07RF devices with enhanced performance and methods of forming the same
#11 | 2021-08-19Gallium-nitride-based module with enhanced electrical performance and process for making the same
#12 | 2020-07-23RF devices with enhanced performance and methods of forming the same
#13 | 2020-07-23RF devices with enhanced performance and methods of forming the same
#14 | 2020-07-23RF device without silicon handle substrate for enhanced thermal and electrical performance and methods of forming the same
#15 | 2020-07-23RF devices with enhanced performance and methods of forming the same
#16 | 2020-07-23RF devices with enhanced performance and methods of forming the same
#17 | 2020-07-23RF devices with enhanced performance and methods of forming the same
#18 | 2020-01-02RF devices with enhanced performance and methods of forming the same
#19 | 2019-10-24RF devices with enhanced performance and methods of forming the same utilizing localized SOI formation
#20 | 2019-10-10Gallium-nitride-based module with enhanced electrical performance and process for making the same
#21 | 2019-10-03Bulk CMOS devices with enhanced performance and methods of forming the same utilizing bulk CMOS process
#22 | 2016-12-29Suppression of back-gate transistors in RF CMOS switches built on an SOI substrate
#23 | 2016-11-01Voltage equalization for stacked FETs in RF switches
#24 | 2016-05-31Remote gate protection diode for field effect transistors
#25 | 2016-01-28Radio frequency (RF) microelectromechanical systems (MEMS) devices with gold-doped silicon
#26 | 2015-12-24SOI WITH GOLD-DOPED HANDLE WAFER
#27 | 2015-11-26RF SWITCH STRUCTURE HAVING REDUCED OFF-STATE CAPACITANCE
#28 | 2014-10-16SEMICONDUCTOR DEVICE WITH A POLYMER SUBSTRATE AND METHODS OF MANUFACTURING THE SAME
#29 | 2014-09-11Patterned silicon-on-plastic (SOP) technology and methods of manufacturing the same
#30 | 2014-09-11SILICON-ON-DUAL PLASTIC (SODP) TECHNOLOGY AND METHODS OF MANUFACTURING THE SAME
#31 | 2014-08-28SEMICONDUCTOR RADIO FREQUENCY SWITCH WITH BODY CONTACT
#32 | 2014-05-13Semiconductor radio frequency switch with body contact
#33 | 2012-08-30Vertical ballast technology for power HBT device
#34 | 2011-12-13Linearity improvements of semiconductor substrate based radio frequency devices
#35 | 2011-03-29Linearity improvements of semiconductor substrate using passivation
#36 | 2011-01-11Linearity improvements of semiconductor substrate based radio frequency devices
#37 | 2010-08-10Performance enhanced silicon-on-insulator technology
#38 | 2008-06-03Integrated metal shield for a field effect transistor
#39 | 2006-11-14Integrated power devices and signal isolation structure
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