TETSUO EJIRI

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2018-10-04

Top Assignees for applications by TETSUO EJIRI

The entities that hold a legal rights for patent applications filed by inventor EJIRI TETSUO:

TETSUO EJIRI from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Thermally-expandable microspheres, and composition and molded article containing same

LARGE-DIAMETER HEAT-EXPANDING MICROSPHERES AND METHOD FOR PRODUCING SAME

HEAT-EXPANDABLE MICROSPHERES

Thermally foamable microsphere, method of producing the same, and use thereof

Thermally foamable microsphere, method of producing the same, and use thereof

Thermally foamable microsphere, method of producing the same, and use thereof

InventorID:

890078 ⎘