Richmond, Vermont
United States
16
2016-11-24
The entities that hold a legal rights for patent applications filed by inventor Thomas David C.:
David C. Thomas from Richmond, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor device with metal extrusion formation
#2 | 2016-11-24Semiconductor device with metal extrusion formation
#3 | 2015-12-31Semiconductor device with metal extrusion formation
#4 | 2015-12-03Tsv wafer with improved fracture strength
#5 | 2015-09-10Methods of forming a TSV wafer with improved fracture strength
#6 | 2015-09-10Controlled metal extrusion opening in semiconductor structure and method of forming
#7 | 2015-02-05Method for reducing lateral extrusion formed in semiconductor structures and semiconductor structures formed thereof
#8 | 2015-01-22Uniform roughness on backside of a wafer
#9 | 2014-10-02Semiconductor structures with metal lines
#10 | 2014-09-04Controlled metal extrusion opening in semiconductor structure and method of forming
#11 | 2012-01-19Fuse structure having crack stop void, method for forming and programming same, and design structure
#12 | 2011-09-15Electromigration resistant aluminum-based metal interconnect structure
#13 | 2010-09-23Electromigration resistant aluminum-based metal interconnect structure
#14 | 2009-09-17TUNGSTEN LINER FOR ALUMINUM-BASED ELECTROMIGRATION RESISTANT INTERCONNECT STRUCTURE
#15 | 2007-11-29FULL REMOVAL OF DUAL DAMASCENE METAL LEVEL
#16 | 2006-01-03Single and multilevel rework
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