Ibaraki
Japan
9
2014-06-05
The entities that hold a legal rights for patent applications filed by inventor FUJIMOTO Daisuke:
Daisuke FUJIMOTO from Ibaraki, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR CIRCUIT BOARD AND PRODUCTION METHOD FOR SAME, AND MULTILAYER CIRCUIT BOARD AND PRODUCTION METHOD FOR SAME
#2 | 2013-02-14PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE, THERMOSETTING RESIN AND, PROVIDED USING THE SAME, RESIN VARNISH FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE
#3 | 2012-12-06PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF, MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF
#4 | 2010-09-16Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same
#5 | 2010-05-27Process for producing resin varnish containing semi-IPN composite thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate
#6 | 2009-12-31Conductor Foil with Adhesive Layer, Conductor-Clad Laminate, Printed Wiring Board and Multilayer Wiring Board
#7 | 2007-09-06Resin composition excellent in dielectric properties, process for producing the same, varnish produced using the same, process for producing the varnish, and prepreg and metal-clad laminate using the resin composition and varnish
#8 | 2007-01-02Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepeg made with these, and metal-clad laminate
#9 | 2006-07-27Composition of polycyanate ester and biphenyl epoxy resin
89830 ⎘