Tokyo
Japan
12
2021-07-08
The entities that hold a legal rights for patent applications filed by inventor Uno Takeo:
Takeo Uno from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Surface-treated copper foil, and copper-clad laminate and circuit board using same
#2 | 2020-01-23Surface-treated copper foil, and copper-clad laminate and printed wiring board using same
#3 | 2013-02-14Surface-treated copper foil, method for producing same, and copper clad laminated board
#4 | 2012-11-15ROUGHENED COPPER FOIL, METHOD FOR PRODUCING SAME, COPPER CLAD LAMINATED BOARD, AND PRINTED CIRCUIT BOARD
#5 | 2011-09-01Ultra-thin copper foil with carrier and copper-clad laminate board or printed circuit board substrate
#6 | 2011-08-04Flexible copper clad laminate
#7 | 2011-08-04Surface treated copper foil and copper clad laminate
#8 | 2010-12-02Metal material for electrical electronic component
#9 | 2010-09-16SILVER-COATED COMPOSITE MATERIAL FOR MOVABLE CONTACT AND METHOD FOR MANUFACTURING THE SAME
#10 | 2010-09-02COPPER ALLOY STRIP MATERIAL FOR ELECTRICAL/ELECTRONIC COMPONENTS
#11 | 2010-07-29Connector and metallic material for connector
#12 | 2007-01-18Copper alloy for electronic machinery and tools and method of producing the same
89856 ⎘