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Inventor profile of:

Daisuke SATO

City:

Tochigi

Country:

Japan

Published Applications:

Last publication date:

2023-10-05

Top Assignees for applications by Daisuke SATO

The entities that hold a legal rights for patent applications filed by inventor SATO Daisuke:

DEXERIALS CORPORATION 5 Tokyo, Japan
SONY CHEMICAL &INFORMATION DEVICE CORPORATION 5 TOKYO, Japan
DEXERIALS CORPORATION 2 Shimotsuke-shi, Tochigi, Japan
CANON KABUSHIKI KAISHA 2 Tokyo, Japan
DEXERIALS CORPORATION 2 Shimotsuke, Japan
Sony Chemical & Information Device Corporation 1 Shinagawa-ku, Japan
Dexerials Corporation 1 Shinagawa-ku, Tokyo, Japan

Recent patent applications by SATO Daisuke

Daisuke SATO from Tochigi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-10-05

US20230309942A1

Human necessities

RADIATION IMAGING APPARATUS, RADIATION IMAGING METHOD, AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM

#2 | 2023-06-22

US20230198186A1

Electricity

CONNECTION BODY AND METHOD FOR MANUFACTURING CONNECTION BODY

#3 | 2023-04-13

US20230114848A1

Human necessities

BONE INFORMATION ACQUISITION APPARATUS, NOTIFICATION APPARATUS, X-RAY DIAGNOSIS APPARATUS, BONE INFORMATION ACQUISITION METHOD, AND STORAGE MEDIUM

#4 | 2023-04-06

US20230104524A1

Human necessities

X-ray image processing apparatus, x-ray diagnosis apparatus, method, and storage medium

#5 | 2023-03-09

US20230070488A1

Electricity

METHOD FOR MANUFACTURING CONNECTION BODY, AND CONNECTION BODY

#6 | 2019-03-21

US20190085211A1

Chemistry; metallurgy

ADHESIVE AGENT, AND METHOD FOR CONNECTING ELECTRONIC COMPONENT

#7 | 2016-09-08

US20160260683A1

Electricity

Semiconductor device having semiconductor chip affixed to substrate via insulating resin adhesive film

#8 | 2014-12-04

US20140352888A1

Chemistry; metallurgy

ADHESIVE AGENT, AND METHOD FOR CONNECTING ELECTRONIC COMPONENT

#9 | 2014-10-30

US20140318709A1

Chemistry; metallurgy

Electrically conductive adhesive agent, and method for connecting electronic component

#10 | 2014-09-11

US20140251537A1

Electricity

Insulating resin film, bonded structure using insulating resin film, and production method of bonded structure

#11 | 2012-05-24

US20120125671A1

Electricity

Insulating Resin Film, Bonded Structure Using Insulating Resin Film, and Production Method of Bonded Structure

#12 | 2011-09-29

US20110237028A1

Electricity

Method of manufacturing semiconductor device

#13 | 2011-06-30

US20110159713A1

Chemistry; metallurgy

Acrylic insulating adhesive

#14 | 2011-05-26

US20110120767A1

Electricity

ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND METHOD FOR MANUFACTURING CONNECTION ASSEMBLY USING THE SAME

#15 | 2010-04-01

US20100080995A1

Electricity

Method for connecting electronic part and joined structure

#16 | 2009-07-16

US20090178834A1

Electricity

Anisotropic electrically conductive film and connection structure

InventorID:

899631 ⎘