Ryosuke ODAKA

City:

Tochigi

Country:

Japan

Published Applications:

Last publication date:

2026-02-12

Top Assignees for applications by Ryosuke ODAKA

The entities that hold a legal rights for patent applications filed by inventor ODAKA Ryosuke:

DEXERIALS CORPORATION 3 Tokyo, Japan
DEXERIALS CORPORATION 2 Shimotsuke-shi, Tochigi, Japan
DEXERIALS CORPORATION 2 Shimotsuke, Japan
Dexerials Corporation 1 Tochigi, Japan
DEXERIALS CORPORATION 1 Shimotsuke-shi, Japan

Recent patent applications by ODAKA Ryosuke

Ryosuke ODAKA from Tochigi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-02-12

US20260044703A1

Physics

SMART CARD

#2 | 2025-08-07

US20250250466A1

Chemistry; metallurgy

METHOD FOR MANUFACTURING SMART CARD, SMART CARD, AND CONDUCTIVE PARTICLE-CONTAINING HOT-MELT ADHESIVE SHEET

#3 | 2023-06-22

US20230198186A1

Electricity

CONNECTION BODY AND METHOD FOR MANUFACTURING CONNECTION BODY

#4 | 2022-11-17

US20220363953A1

Chemistry; metallurgy

Method for manufacturing smart card

#5 | 2019-03-21

US20190085211A1

Chemistry; metallurgy

ADHESIVE AGENT, AND METHOD FOR CONNECTING ELECTRONIC COMPONENT

#6 | 2014-12-04

US20140352888A1

Chemistry; metallurgy

ADHESIVE AGENT, AND METHOD FOR CONNECTING ELECTRONIC COMPONENT

#7 | 2014-10-30

US20140318709A1

Chemistry; metallurgy

Electrically conductive adhesive agent, and method for connecting electronic component

#8 | 2014-09-11

US20140251537A1

Electricity

Insulating resin film, bonded structure using insulating resin film, and production method of bonded structure

#9 | 2012-05-24

US20120125671A1

Electricity

Insulating Resin Film, Bonded Structure Using Insulating Resin Film, and Production Method of Bonded Structure

InventorID:

899633 ⎘