Inventor profile of:

Hong He

City:

Schenectady, New York

Country:

United States

Published Applications:

153

Last publication date:

2020-03-12

Top Assignees for applications by Hong He

The entities that hold a legal rights for patent applications filed by inventor He Hong:

Recent patent applications by He Hong

Hong He from Schenectady, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2020-03-12
US20200083357A1
Electricity

Silicon germanium alloy fins with reduced defects

#2 | 2020-03-05
US20200075598A1
Electricity

Orientation engineering in complementary metal oxide semiconductor fin field effect transistor integration for increased mobility and sharper junction

#3 | 2019-12-12
US20190378840A1
Electricity

Orientation engineering in complementary metal oxide semiconductor fin field effect transistor integration for increased mobility and sharper junction

#4 | 2019-12-12
US20190378839A1
Electricity

Orientation engineering in complementary metal oxide semiconductor fin field effect transistor integration for increased mobility and sharper junction

#5 | 2019-06-06
US20190172940A1
Electricity

Utilizing multilayer gate spacer to reduce erosion of semiconductor Fin during spacer patterning

#6 | 2019-01-17
US20190019883A1
Electricity

Fin formation in fin field effect transistors

#7 | 2019-01-03
US20190006506A1
Electricity

Utilizing multilayer gate spacer to reduce erosion of semiconductor fin during spacer patterning

#8 | 2018-11-15
US20180331039A1
Electricity

Self-aligned contact process enabled by low temperature

#9 | 2018-11-08
US20180323278A1
Electricity

Integration of strained silicon germanium PFET device and silicon NFET device for finFET structures

#10 | 2018-11-01
US20180315668A1
Electricity

Method of forming silicon germanium and silicon fins on oxide from bulk wafer

#11 | 2018-10-18
US20180301534A1
Electricity

Silicon germanium fin channel formation

#12 | 2018-08-09
US20180223522A1
Fixed constructions

Critical dimension shrink through selective metal growth on metal hardmask sidewalls

#13 | 2018-04-05
US20180097017A1
Electricity

FinFET device with abrupt junctions

#14 | 2018-04-05
US20180096883A1
Electricity

Fabrication of silicon germanium-on-insulator FinFET

#15 | 2018-03-15
US20180076029A1
Electricity

Method and structure for forming a dense array of single crystalline semiconductor nanocrystals

#16 | 2018-03-08
US20180069027A1
Electricity

Preventing strained fin relaxation

#17 | 2018-03-01
US20180061942A1
Electricity

Structure and process to tuck fin tips self-aligned to gates

#18 | 2018-03-01
US20180061941A1
Electricity

Structure and process to tuck fin tips self-aligned to gates

#19 | 2017-12-21
US20170365685A1
Electricity

Integration of strained silicon germanium PFET device and silicon NFET device for finFET structures

#20 | 2017-10-12
US20170294524A1
Electricity

Directional deposition of protection layer

#21 | 2017-09-21
US20170271167A1
Electricity

Fin density control of multigate devices through sidewall image transfer processes

#22 | 2017-09-07
US20170256644A1
Electricity

Directional deposition of protection layer

#23 | 2017-07-06
US20170194481A1
Electricity

Silicon germanium fin channel formation

#24 | 2017-07-06
US20170194463A1
Electricity

Fin formation in fin field effect transistors

#25 | 2017-07-06
US20170194138A1
Electricity

LOW TEMPERATURE SELECTIVE DEPOSITION EMPLOYING A GERMANIUM-CONTAINING GAS ASSISTED ETCH

#26 | 2017-06-15
US20170170321A1
Electricity

Silicon germanium alloy fins with reduced defects

#27 | 2017-06-15
US20170170302A1
Electricity

Silicon germanium alloy fins with reduced defects

#28 | 2017-06-15
US20170170116A1
Electricity

Middle of the line integrated efuse in trench EPI structure

#29 | 2017-06-15
US20170170115A1
Electricity

Middle of the line integrated eFuse in trench EPI structure

#30 | 2017-05-25
US20170148730A1
Electricity

Critical dimension shrink through selective metal growth on metal hardmask sidewalls

#31 | 2017-05-18
US20170141038A1
Electricity

Self-aligned contact process enabled by low temperature

#32 | 2017-05-02
US15135850
Electricity

FinFET device with channel strain

#33 | 2017-04-27
US20170117300A1
Electricity

Preventing strained fin relaxation

#34 | 2017-04-06
US20170098665A1
Electricity

Hybrid substrate engineering in CMOS finFET integration for mobility improvement

#35 | 2017-03-30
US20170092735A1
Electricity

Replacement gate FinFET process using a sit process to define source/drain regions, gate spacers and a gate cavity

#36 | 2017-03-30
US20170092713A1
Electricity

Orientation engineering in complementary metal oxide semiconductor fin field effect transistor integration for increased mobility and sharper junction

#37 | 2017-03-30
US20170092646A1
Electricity

Orientation engineering in complementary metal oxide semiconductor fin field effect transistor integration for increased mobility and sharper junction

#38 | 2017-03-16
US20170076992A1
Electricity

Fin isolation on a bulk wafer

#39 | 2017-03-09
US20170069492A1
Electricity

Formation of SiGe nanotubes

#40 | 2017-02-23
US20170054024A1
Electricity

Strained finFET device fabrication

#41 | 2017-02-23
US20170054002A1
Electricity

Strained finFET device fabrication

#42 | 2017-02-23
US20170053942A1
Electricity

Strained FinFET device fabrication

#43 | 2017-02-23
US20170053838A1
Electricity

Strained finFET device fabrication

#44 | 2017-02-16
US20170047445A1
Electricity

Hybrid substrate engineering in CMOS finFET integration for mobility improvement

#45 | 2017-02-16
US20170047406A1
Electricity

Silicon germanium fin channel formation

#46 | 2017-02-16
US20170047331A1
Electricity

Hybrid substrate engineering in CMOS finFET integration for mobility improvement

#47 | 2017-02-09
US20170040437A1
Electricity

LOW-K SPACER FOR RMG FINFET FORMATION

#48 | 2017-02-09
US20170040417A1
Electricity

Substrate with strained and relaxed silicon regions

#49 | 2017-02-02
US20170033219A1
Electricity

Semiconductor device including fin having condensed channel region

#50 | 2017-02-02
US20170033184A1
Electricity

SEMICONDUCTOR DEVICE INCLUDING FIN HAVING CONDENSED CHANNEL REGION

#51 | 2017-02-02
US20170033104A1
Electricity

FinFETs with non-merged epitaxial S/D extensions having a SiGe seed layer on insulator

#52 | 2017-02-02
US20170033103A1
Electricity

Bulk fin formation with vertical fin sidewall profile

#53 | 2017-01-19
US20170018630A1
Electricity

Silicon germanium fin channel formation

#54 | 2017-01-19
US20170018465A1
Electricity

Silicon germanium and silicon fins on oxide from bulk wafer

#55 | 2016-12-29
US20160379867A1
Electricity

Fabrication of silicon germanium-on-insulator finFET

#56 | 2016-12-29
US20160379823A1
Electricity

Tone inverted directed self-assembly (DSA) fin patterning

#57 | 2016-12-06
US15135844
Electricity

FinFET device with channel strain

#58 | 2016-12-01
US20160351590A1
Electricity

Preventing strained fin relaxation by sealing fin ends

#59 | 2016-12-01
US20160351448A1
Electricity

Critical dimension shrink through selective metal growth on metal hardmask sidewalls

#60 | 2016-12-01
US20160351447A1
Electricity

Critical dimension shrink through selective metal growth on metal hardmask sidewalls

#61 | 2016-11-24
US20160343861A1
Electricity

Structure and process to tuck fin tips self-aligned to gates

#62 | 2016-11-24
US20160343621A1
Electricity

Directly forming SiGe fins on oxide

#63 | 2016-11-22
US14833363
Electricity

Strained finFET device fabrication

#64 | 2016-11-17
US20160336347A1
Electricity

Bulk fin formation with vertical fin sidewall profile

#65 | 2016-11-17
US20160336176A1
Electricity

Method and structure for forming a dense array of single crystalline semiconductor nanocrystals

#66 | 2016-11-15
US14877051
Electricity

Channel protection during fin fabrication

#67 | 2016-11-10
US20160329415A1
Electricity

Work function metal fill for replacement gate fin field effect transistor process

#68 | 2016-11-03
US20160322501A1
Electricity

Silicon germanium alloy fins with reduced defects

#69 | 2016-10-27
US20160315175A1
Electricity

Method and structure of forming FinFET electrical fuse structure

#70 | 2016-10-27
US20160315049A1
Electricity

Method and structure of forming FinFET electrical fuse structure

#71 | 2016-10-18
US14955738
Electricity

CMOS structures with selective tensile strained NFET fins and relaxed PFET fins

#72 | 2016-10-13
US20160300721A1
Electricity

Work function metal fill for replacement gate fin field effect transistor process

#73 | 2016-10-06
US20160293704A1
Electricity

Hybrid aspect ratio trapping

#74 | 2016-08-30
US14674586
Electricity

Directly forming SiGe fins on oxide

#75 | 2016-08-25
US20160247883A1
Electricity

Epitaxial silicon germanium fin formation using sacrificial silicon fin templates

#76 | 2016-08-25
US20160247677A1
Electricity

Epitaxial silicon germanium fin formation using sacrificial silicon fin templates

#77 | 2016-08-16
US14800290
Electricity

Silicon germanium and silicon fins on oxide from bulk wafer

#78 | 2016-08-11
US20160233243A1
Electricity

Dual isolation on SSOI wafer

#79 | 2016-08-11
US20160233242A1
Electricity

CMOS structure on SSOI wafer

#80 | 2016-08-11
US20160233241A1
Electricity

Dual isolation on SSOI wafer

#81 | 2016-08-11
US20160233240A1
Electricity

CMOS structure on SSOI wafer

#82 | 2016-08-04
US20160225789A1
Electricity

Replacement fin process in SSOI wafer

#83 | 2016-08-04
US20160225770A1
Electricity

Replacement fin process in SSOI wafer

#84 | 2016-07-28
US20160218215A1
Electricity

Integration of strained silicon germanium PFET device and silicon NFET device for FINFET structures

#85 | 2016-07-28
US20160218192A1
Electricity

Integration of strained silicon germanium PFET device and silicon NFET device for finFET structures

#86 | 2016-07-14
US20160204257A1
Electricity

Self-aligned contact process enabled by low temperature

#87 | 2016-07-14
US20160204221A1
Electricity

Bottom-up metal gate formation on replacement metal gate finFET devices

#88 | 2016-06-30
US20160190304A1
Electricity

Semiconductor integrated structure having an epitaxial SiGe layer extending from silicon-containing regions formed between segments of oxide regions

#89 | 2016-06-30
US20160190303A1
Electricity

Silicon germanium-on-insulator FinFET

#90 | 2016-06-30
US20160190288A1
Electricity

Enriched, high mobility strained fin having bottom dielectric isolation

#91 | 2016-06-30
US20160190285A1
Electricity

Enriched, high mobility strained fin having bottom dielectric isolation

#92 | 2016-06-16
US20160172448A1
Electricity

FinFET with a silicon germanium alloy channel and method of fabrication thereof

#93 | 2016-06-14
US14747487
Electricity

Tone inverted directed self-assembly (DSA) fin patterning

#94 | 2016-05-24
US14753386
Electricity

CMOS structures with selective tensile strained NFET fins and relaxed PFET fins

#95 | 2016-05-12
US20160133573A1
Electricity

Microstructure of metal interconnect layer

#96 | 2016-05-03
US14962194
Electricity

FinFET device with channel strain

#97 | 2016-04-28
US20160118302A1
Electricity

Gate structure integration scheme for fin field effect transistors

#98 | 2016-04-21
US20160111525A1
Electricity

Fin formation in fin field effect transistors

#99 | 2016-03-31
US20160093697A1
Electricity

EPITAXIALLY GROWN QUANTUM WELL FINFETS FOR ENHANCED PFET PERFORMANCE

#100 | 2016-03-31
US20160093613A1
Electricity

Epitaxially grown quantum well finFETs for enhanced pFET performance

InventorID:

90577 ⎘