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Inventor profile of:

Andreas GLEISSNER

City:

DOBRIACH

Country:

Austria

Published Applications:

Last publication date:

2025-10-30

Top Assignees for applications by Andreas GLEISSNER

The entities that hold a legal rights for patent applications filed by inventor GLEISSNER Andreas:

Semsysco GmbH 12 Salzburg, Austria
LAM RESEARCH AG 8 VILLACH, Austria
LAM RESEARCH AG 1 , Austria
Semsyso GMBH 1 Salzburg, Austria
Semsysco GmbH 1 Satzburg, Austria
LAM RESEARCH SALZBURG GMBH 1 Salzburg-Gnigl, Austria

Recent patent applications by GLEISSNER Andreas

Andreas GLEISSNER from DOBRIACH, AT has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-10-30

US20250333874A1

Chemistry; metallurgy

MODULE KIT FOR A CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE

#2 | 2025-05-22

US20250162176A1

Performing operations; transporting

SUBSTRATE HANDLING DEVICE FOR HANDLING A SUBSTRATE

#3 | 2025-05-08

US20250146165A1

Chemistry; metallurgy

SYSTEM FOR A CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE

#4 | 2025-05-01

US20250137161A1

Chemistry; metallurgy

SUBSTRATE HOLDER FOR HOLDING A SUBSTRATE IN A CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF THE SUBSTRATE

#5 | 2025-01-30

US20250034709A1

Chemistry; metallurgy

DISTRIBUTION BODY FOR DISTRIBUTING A PROCESS GAS FOR TREATING A SUBSTRATE BY MEANS OF THE PROCESS GAS

#6 | 2024-05-02

US20240145231A1

Electricity

SYSTEM AND METHOD FOR A SURFACE TREATMENT OF A SUBSTRATE WITH A LIQUID

#7 | 2024-05-02

US20240141535A1

Chemistry; metallurgy

SYSTEM FOR A CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE

#8 | 2024-05-02

US20240141534A1

Chemistry; metallurgy

DISTRIBUTION SYSTEM FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE

#9 | 2024-01-11

US20240011180A1

Chemistry; metallurgy

DISTRIBUTION SYSTEM FOR A PROCESS FLUID AND AN ELECTRIC CURRENT FOR A CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE

#10 | 2023-10-05

US20230313407A1

Chemistry; metallurgy

SHIELD BODY SYSTEM FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE

#11 | 2023-08-24

US20230265577A1

Chemistry; metallurgy

PLATING FRAME UNIT FOR HOLDING A SUBSTRATE IN A CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF THE SUBSTRATE

#12 | 2023-08-17

US20230260823A1

Electricity

Clipping mechanism for fastening a substrate for a surface treatment of the substrate

#13 | 2023-08-10

US20230250547A1

Chemistry; metallurgy

Distribution System for a Process Fluid for a Chemical and/or Electrolytic Surface Treatment of a Substrate

#14 | 2023-07-20

US20230226578A1

Performing operations; transporting

Module for chemically processing a substrate

#15 | 2023-06-22

US20230193503A1

Chemistry; metallurgy

DISTRIBUTION SYSTEM FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A ROTATABLE SUBSTRATE

#16 | 2023-03-30

US20230095518A1

Chemistry; metallurgy

METHOD FOR A CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE IN A PROCESS STATION

#17 | 2023-03-09

US20230075605A1

Chemistry; metallurgy

DISTRIBUTION SYSTEM FOR A PROCESS FLUID AND ELECTRIC CURRENT FOR CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE

#18 | 2023-02-23

US20230056444A1

Chemistry; metallurgy

ELECTROCHEMICAL DEPOSITION SYSTEM FOR A CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE

#19 | 2023-02-16

US20230053226A1

Chemistry; metallurgy

Substrate holding and locking system for chemical and/or electrolytic surface treatment

#20 | 2023-01-26

US20230026551A1

Chemistry; metallurgy

DISTRIBUTION BODY FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE

#21 | 2023-01-12

US20230008513A1

Chemistry; metallurgy

DISTRIBUTION SYSTEM FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE

#22 | 2022-08-18

US20220262668A1

Electricity

Substrate handling device for a wafer

#23 | 2022-01-20

US20220020591A1

Electricity

Method and device for plating a recess in a substrate

#24 | 2021-01-21

US20210017662A1

Chemistry; metallurgy

Substrate locking system, device and procedure for chemical and/or electrolytic surface treatment

#25 | 2019-07-25

US20190228975A1

Electricity

Method and device for plating a recess in a substrate

#26 | 2019-01-31

US20190032240A1

Chemistry; metallurgy

Distribution system for chemical and/or electrolytic surface treatment

#27 | 2019-01-31

US20190032234A1

Chemistry; metallurgy

Substrate locking system, device and procedure for chemical and/or electrolytic surface treatment

#28 | 2017-11-09

US20170323823A1

Electricity

Method and apparatus for processing wafer-shaped articles

#29 | 2017-06-08

US20170162427A1

Electricity

Spin chuck with in situ cleaning capability

#30 | 2017-06-08

US20170162426A1

Electricity

SPIN CHUCK WITH GAS LEAKAGE PREVENTION

#31 | 2017-06-08

US20170162405A1

Electricity

SPIN CHUCK WITH HEATED NOZZLE ASSEMBLY

#32 | 2017-05-04

US20170125281A1

Electricity

Apparatus for treating surfaces of wafer-shaped articles

#33 | 2017-05-04

US20170125266A1

Electricity

Apparatus for treating surfaces of wafer-shaped articles

#34 | 2016-08-11

US20160230278A1

Chemistry; metallurgy

Spin chuck with rotating gas showerhead

#35 | 2015-07-02

US20150187629A1

Electricity

Apparatus for treating surfaces of wafer-shaped articles

#36 | 2015-07-02

US20150187624A1

Electricity

Apparatus for treating surfaces of wafer-shaped articles

#37 | 2015-01-08

US20150008632A1

Electricity

Device for holding wafer shaped articles

#38 | 2014-09-25

US20140283994A1

Electricity

APPARATUS FOR TREATING SURFACES OF WAFER-SHAPED ARTICLES

InventorID:

908876 ⎘