Osaka
Japan
3
2017-04-20
The entities that hold a legal rights for patent applications filed by inventor IWASA Eiji:
Eiji IWASA from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
THERMOPLASTIC RESIN COMPOSITION AND MOLDED PRODUCTS FORMED THEREOF
#2 | 2014-09-25THERMOPLASTIC RESIN COMPOSITION AND MOLDED PRODUCTS FORMED THEREOF
#3 | 2009-09-24Polylactic acid composition
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