Ottawa
Canada
23
2022-07-14
The entities that hold a legal rights for patent applications filed by inventor KOVACIC Stephen Joseph:
Stephen Joseph KOVACIC from Ottawa, CA has applied for patents for these inventions. The list has both pending applications and granted patents:
Beamforming communication systems with power amplifier output impedance tuning control
#2 | 2022-01-13Reconfigurable antenna systems integrated with metal case
#3 | 2021-07-01Planar end fire antenna for wideband low form factor applications
#4 | 2021-05-27Beamforming communication systems with power amplifier output impedance tuning control
#5 | 2021-04-22Direct substrate to solder bump connection for thermal management in flip chip amplifiers
#6 | 2021-03-25Apparatus and methods for dynamic management of antenna arrays
#7 | 2021-01-14APPARATUS AND METHODS FOR DYNAMIC MANAGEMENT OF ANTENNA ARRAYS
#8 | 2020-11-19Reconfigurable antenna systems integrated with metal case
#9 | 2020-05-28Radio front end module with reduced loss and increased linearity
#10 | 2020-02-27Planar end fire antenna for wideband low form factor applications
#11 | 2019-12-05Beamforming communication systems with power control based on antenna pattern configuration
#12 | 2019-05-16Power amplifiers isolated by differential ground
#13 | 2019-01-24Direct substrate to solder bump connection for thermal management in flip chip amplifiers
#14 | 2018-10-11RADIO-FREQUENCY MODULE WITH INTEGRATED SHIELD LAYER ANTENNA AND INTEGRATED CAVITY-BASED ANTENNA
#15 | 2018-10-11Method of manufacturing a radio-frequency module with a conformal shield antenna
#16 | 2018-10-11RADIO-FREQUENCY MODULE WITH INTEGRATED CONFORMAL SHIELD ANTENNA
#17 | 2018-07-12APPARATUS AND METHODS FOR DYNAMIC MANAGEMENT OF ANTENNA ARRAYS
#18 | 2018-03-15Power amplifier systems with differential ground
#19 | 2018-03-08Planar end fire antenna for wideband low form factor applications
#20 | 2018-03-08Antenna for radio-frequency electronics
#21 | 2017-04-27Direct substrate to solder bump connection for thermal management in flip chip amplifiers
#22 | 2014-10-02SEMICONDUCTOR DEVICE HEAT DISSIPATION USING HIGH THERMAL CONDUCTIVITY DIELECTRIC LAYER
#23 | 2014-10-02PHASE NOISE REDUCTION IN TRANSISTOR DEVICES
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