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Inventor profile of:

Neyoshi Ishida

City:

Tokyo

Country:

Japan

Published Applications:

1

Last publication date:

2014-10-02

Recent patent applications by Ishida Neyoshi

Neyoshi Ishida from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-10-02

US20140296394A1

Chemistry; metallurgy

Adhesive Composition

InventorID:

922829 ⎘