Inventor profile of:

Terry Tarn

City:

San Diego, California

Country:

United States

Published Applications:

15

Last publication date:

2014-10-09

Top Assignees for applications by Terry Tarn

The entities that hold a legal rights for patent applications filed by inventor Tarn Terry:

Recent patent applications by Tarn Terry

Terry Tarn from San Diego, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-10-09
US20140299653A1
Physics

Micromirror array assembly

#2 | 2012-07-19
US20120180949A1
Performing operations; transporting

Microelectromechanical device packages with integral heaters

#3 | 2010-12-02
US20100302618A1
Physics

Micromirror array assembly with in-array pillars

#4 | 2009-04-16
US20090098685A1
Performing operations; transporting

Low cost hermetically sealed package

#5 | 2009-03-19
US20090072380A1
Performing operations; transporting

Microelectromechanical device packages with integral heaters

#6 | 2008-07-22
US10852981
-

Packaging method for microstructure and semiconductor devices

#7 | 2006-10-05
US20060220199A1
Performing operations; transporting

Low cost hermetically sealed package

#8 | 2006-10-05
US20060220045A1
Physics

Micromirror array device with compliant adhesive

#9 | 2006-04-20
US20060082859A1
Physics

Light blocking layers in MEMS packages

#10 | 2006-02-09
US20060027915A1
Performing operations; transporting

Device packages with low stress assembly process

#11 | 2005-12-15
US20050275931A1
Physics

Electrical contacts in microelectromechanical devices with multiple substrates

#12 | 2005-12-15
US20050275930A1
Physics

Micromirror array assembly with in-array pillars

#13 | 2005-08-25
US20050185248A1
Performing operations; transporting

Microelectromechanical device packages with integral heaters

#14 | 2005-07-21
US20050157374A1
Performing operations; transporting

Microelectromechanical device packages with integral heaters

#15 | 2005-05-05
US20050093134A1
Performing operations; transporting

Device packages with low stress assembly process

InventorID:

926860 ⎘