Wei CHEN

City:

Saga-ken

Country:

Japan

Published Applications:

Last publication date:

2017-05-04

Top Assignees for applications by Wei CHEN

The entities that hold a legal rights for patent applications filed by inventor CHEN Wei:

Wei CHEN from Saga-ken, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

NOBLE METAL-COATED COPPER WIRE FOR BALL BONDING

Palladium (Pd)-coated copper wire for ball bonding

Silver—gold alloy bonding wire

Bonding wire for high-speed signal line

InventorID:

929704 ⎘