Guofeng Xia

City:

Beijing

Country:

China

Published Applications:

Last publication date:

2015-12-03

Top Assignees for applications by Guofeng Xia

The entities that hold a legal rights for patent applications filed by inventor Xia Guofeng:

Guofeng Xia from Beijing, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

Package in package (PiP) electronic device and manufacturing method thereof

FCOC (Flip Chip On Chip) package and manufacturing method thereof

InventorID:

930199 ⎘