Su MI IM

City:

Uiwang-si

Country:

South Korea

Published Applications:

Last publication date:

2016-05-19

Top Assignees for applications by Su MI IM

The entities that hold a legal rights for patent applications filed by inventor IM Su MI:

Su MI IM from Uiwang-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ENCAPSULATED USING THE SAME

Dicing die-bonding film and method of forming a cut on the dicing die-bonding film

Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding film

ATTACH FILM COMPOSITION FOR SEMICONDUCTOR ASSEMBLY AND ATTACH FILM USING THE SAME

Adhesive film composition for semiconductor assembly, adhesive film, dicing die bonding film, device package, and associated methods

Bonding film composition for semiconductor assembly, bonding film therefrom, and dicing die bond film comprising the same

InventorID:

934839 ⎘