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Inventor profile of:

Fut (Kuo) Yang

City:

Country:

United States

Published Applications:

1

Last publication date:

2014-10-23

Recent patent applications by Yang Fut (Kuo)

Fut (Kuo) Yang from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-10-23

US20140311673A1

Chemistry; metallurgy

Method and apparatus for adhesive bonding in an aqueous medium

InventorID:

940845 ⎘