Jae-Cheon Doh

City:

Suwon

Country:

Korea (South)

Published Applications:

Last publication date:

2014-12-25

Top Assignees for applications by Jae-Cheon Doh

The entities that hold a legal rights for patent applications filed by inventor Doh Jae-Cheon:

Jae-Cheon Doh from Suwon, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

Electric component module and method of manufacturing the same

ELECTRONIC COMPONENT PACKAGE

Wafer level package fabrication method

Wafer level package of image sensor and method for manufacturing the same

Camera module package

Method for manufacturing semiconductor package

InventorID:

943051 ⎘