Keonsoo JANG

City:

Suwon-si

Country:

South Korea

Published Applications:

Last publication date:

2014-10-30

Top Assignees for applications by Keonsoo JANG

The entities that hold a legal rights for patent applications filed by inventor JANG Keonsoo:

Keonsoo JANG from Suwon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

Composition and methods of forming solder bump and flip chip using the same

Composition and methods of forming solder bump and flip chip using the same

InventorID:

948237 ⎘