Hideki EIFUKU

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2016-09-01

Top Assignees for applications by Hideki EIFUKU

The entities that hold a legal rights for patent applications filed by inventor EIFUKU Hideki:

PANASONIC CORPORATION 6 Osaka, Japan
Panasonic Intellectual Property Management Co., Ltd. 4 Osaka, Japan
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 1 Osaka, Japan

Recent patent applications by EIFUKU Hideki

Hideki EIFUKU from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2016-09-01

US20160255716A1

Electricity

Manufacturing method of electronic component, electronic component, and manufacturing apparatus of electronic component

#2 | 2015-07-23

US20150208509A1

Electricity

Component-mounted structure

#3 | 2015-05-07

US20150121692A1

Electricity

Electric component mounting method

#4 | 2015-02-19

US20150047185A1

Electricity

Electrode joining method, production method of electrode joined structure

#5 | 2014-10-30

US20140318837A1

Electricity

Circuit board interconnection structure and circuit board interconnection method

#6 | 2012-09-20

US20120234496A1

Performing operations; transporting

Substrate backing device and substrate thermocompression-bonding device

#7 | 2012-01-19

US20120014084A1

Electricity

Electronic component mounting system and electronic component mounting method

#8 | 2012-01-19

US20120012645A1

Electricity

Electronic component mounting system and electronic component mounting method

#9 | 2009-11-26

US20090291314A1

Electricity

Electronic components mounting adhesive and electronic components mounting structure

InventorID:

949345 ⎘