Volker SCHMITZ

City:

Pfullingen

Country:

Germany

Published Applications:

Last publication date:

2026-04-09

Top Assignees for applications by Volker SCHMITZ

The entities that hold a legal rights for patent applications filed by inventor SCHMITZ Volker:

Robert Bosch GMBH 7 Stuttgart, Germany

Recent patent applications by SCHMITZ Volker

Volker SCHMITZ from Pfullingen, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-04-09

US20260101812A1

Electricity

MICROSTRUCTURED IC CHIP

#2 | 2024-08-08

US20240262682A1

Performing operations; transporting

METHOD FOR PRODUCING A MICROMECHANICAL DEVICE COMPRISING A CAVITY HAVING A MELT SEAL

#3 | 2019-05-09

US20190135617A1

Performing operations; transporting

Method for bonding wafers eutectically, and a wafer composite

#4 | 2018-04-26

US20180111828A1

Performing operations; transporting

Method for producing a micromechanical component

#5 | 2018-02-15

US20180044171A1

Performing operations; transporting

Micro-mechanical component

#6 | 2014-11-06

US20140327154A1

Performing operations; transporting

Micromechanical component and method for producing a micromechanical component having a thin-layer cap

#7 | 2011-01-13

US20110006444A1

Performing operations; transporting

Micromechanical component and method for producing a micromechanical component having a thin-layer cap

#8 | 2009-07-09

US20090174148A1

Performing operations; transporting

Method for sealing an opening

#9 | 2009-04-09

US20090090531A1

Performing operations; transporting

Micromechanical component having a cap having a closure

InventorID:

958761 ⎘