Daisuke SHANAI

City:

Hitachi

Country:

Japan

Published Applications:

Last publication date:

2014-07-24

Top Assignees for applications by Daisuke SHANAI

The entities that hold a legal rights for patent applications filed by inventor SHANAI Daisuke:

HITACHI METALS, LTD. 7 TOKYO, Japan
Hitachi Cable, Ltd. 6 Tokyo, Japan
HITACHI CABLE FINE-TECH, LTD. 2 HITACHI-SHI, Japan

Recent patent applications by SHANAI Daisuke

Daisuke SHANAI from Hitachi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-07-24

US20140202737A1

Chemistry; metallurgy

Adhesive varnish, adhesive film and wiring film

#2 | 2014-06-12

US20140158413A1

Electricity

Adhesive composition, adhesive varnish, adhesive film and wiring film

#3 | 2014-06-12

US20140158398A1

Electricity

Adhesive resin composition, adhesive film using the same and flat cable

#4 | 2013-09-12

US20130233590A1

Chemistry; metallurgy

Adhesive film and flat cable using the same

#5 | 2013-08-29

US20130220677A1

Chemistry; metallurgy

Thermosetting adhesive composition, and heat resistant adhesive film and wiring film using the same

#6 | 2013-08-29

US20130220674A1

Chemistry; metallurgy

Adhesive composition, varnish, adhesive film and wiring film

#7 | 2013-02-21

US20130043058A1

Chemistry; metallurgy

ADHESIVE FILM AND FLAT CABLE

#8 | 2012-10-11

US20120255761A1

Chemistry; metallurgy

Adhesive film and flat cable using same

#9 | 2011-08-18

US20110198105A1

Electricity

NON-HALOGEN FLAME RETARDANT RESIN COMPOSITION AND ELECTRIC WIRE AND CABLE USING THE SAME

InventorID:

96238 ⎘