Jean Audet

Photonics package with face-to-face bonding

Thin film capacitors for core and adjacent build up layers

Automated generation of surface-mount package design

Semiconductor package floating metal checks

High-density chip-to-chip interconnection with silicon bridge

Thin film capacitors for core and adjacent build up layers

Semiconductor package floating metal checks

Interposer with lattice construction and embedded conductive metal structures

Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance

Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance

Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance

Interposer with lattice construction and embedded conductive metal structures

Interposer with lattice construction and embedded conductive metal structures

Method for forming coreless flip chip ball grid array (FCBGA) substrates and such substrates formed by the method

Method for determining the impact of layer thicknesses on laminate warpage

High performance chip carrier substrate

High performance chip carrier substrate

Apparatus for crack prevention in integrated circuit packages

Semiconductor package having non-aligned active vias

Power grid structure to optimize performance of a multiple core processor

Apparatus and method for customized burn-in of cores on a multicore microprocessor integrated circuit chip

High performance chip carrier substrate

Concurrent electrical signal wiring optimization for an electronic package

High performance chip carrier substrate