Keisuke Kitazato

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2014-11-13

Top Assignees for applications by Keisuke Kitazato

The entities that hold a legal rights for patent applications filed by inventor Kitazato Keisuke:

Keisuke Kitazato from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

METHOD FOR MANUFACTURING WIRE, APPARATUS FOR MANUFACTURING WIRE, AND COPPER ALLOY WIRE

COPPER ALLOY MATERIAL FOR ELECTRIC/ELECTRONIC PARTS AND METHOD OF PRODUCING THE SAME

Method for manufacturing wire, apparatus for manufacturing wire, and copper alloy wire

InventorID:

964461 ⎘