Gary H. Bernstein

City:

Granger, Indiana

Country:

United States

Published Applications:

Last publication date:

2017-08-10

Top Assignees for applications by Gary H. Bernstein

The entities that hold a legal rights for patent applications filed by inventor Bernstein Gary H.:

University of Notre Dame du Lac 7 Notre Dame, IN United States
THE UNIVERSITY OF NOTRE DAME DU LAC 1 Notre Dame, IN United States
Indiana Integrated Circuits, LLC 1 South Bend, IN United States
UNIVERSITY OF NOTRE DAME DU LAC 1 South Bend, IN United States
University of Norte Dame Du Lac 1 Notre Dame, IN United States

Recent patent applications by Bernstein Gary H.

Gary H. Bernstein from Granger, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2017-08-10

US20170229416A1

Electricity

Inter-chip alignment

#2 | 2017-06-22

US20170179093A1

Electricity

Quilt packaging system with mated metal interconnect nodules and voids

#3 | 2017-04-25

US14090993

Electricity

Systems and methods for inter-chip communication

#4 | 2017-04-11

US14158079

Electricity

Quilt packaging system with interdigitated interconnecting nodules for inter-chip alignment

#5 | 2014-11-20

US20140338712A1

Electricity

Mono-metallic thermocouples

#6 | 2014-01-07

US11599283

Inter-chip communication

#7 | 2011-09-20

US11599374

Inter-chip communication

#8 | 2010-12-16

US20100315123A1

Physics

Non-majority MQCA magnetic logic gates and arrays based on misaligned magnetic islands

#9 | 2009-11-03

US10933417

Inter-chip communication

#10 | 2009-10-27

US11599257

Interconnect packaging systems

InventorID:

971712 ⎘