Inventor profile of:

Daniel Piper

City:

Vancouver, Washington

Country:

United States

Published Applications:

18

Last publication date:

2025-02-13

Top Assignees for applications by Daniel Piper

The entities that hold a legal rights for patent applications filed by inventor Piper Daniel:

Recent patent applications by Piper Daniel

Daniel Piper from Vancouver, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-02-13
US20250054874A1
Electricity

THREE-DIMENSIONAL SELF-REFERENCE MARKING FEATURES

#2 | 2020-02-27
US20200061611A1
Performing operations; transporting

MEMS optical liquid level sensor

#3 | 2020-01-09
US20200013725A1
Electricity

Optical chip ID definition using nanoimprint lithography

#4 | 2020-01-02
US20200001257A1
Performing operations; transporting

Micro electrical mechanical system (MEMS) multiplexing mixing

#5 | 2019-10-29
US16170013
Physics

MEMS optical sensor

#6 | 2019-10-24
US20190323627A1
Mechanical engineering

Micro electrical mechanical system (MEMS) valve

#7 | 2019-10-03
US20190304920A1
Electricity

Optical chip ID definition using nanoimprint lithography

#8 | 2019-07-18
US20190219193A1
Mechanical engineering

Micro electrical mechanical system (MEMS) valve

#9 | 2019-07-18
US20190219192A1
Mechanical engineering

Micro electrical mechanical system (MEMS) valve

#10 | 2019-05-30
US20190162578A1
Physics

Self-cleaning liquid level sensor

#11 | 2019-03-26
US15827063
Electricity

Optical electronic-chip identification writer using dummy C4 bumps

#12 | 2016-05-05
US20160126152A1
Electricity

Test structure for determining overlay accuracy in semiconductor devices using resistance measurement

#13 | 2013-12-19
US20130334652A1
Electricity

Nitride shallow trench isolation (STI) structures

#14 | 2013-10-31
US20130285195A1
Electricity

Vertical integrated semiconductor device with multiple continuous single crystal silicon layers vertically separated from one another

#15 | 2013-02-28
US20130049161A1
Electricity

Nitride shallow trench isolation (STI) structures and methods for forming the same

#16 | 2013-02-28
US20130048979A1
Electricity

Test structure and method for determining overlay accuracy in semiconductor devices using resistance measurement

#17 | 2013-02-21
US20130043554A1
Electricity

Method of fabricating vertical integrated semiconductor device with multiple continuous single crystal silicon layers vertically separated from one another

#18 | 2007-07-05
US20070156275A1
Electricity

Automated metrology recipe generation

InventorID:

97254 ⎘